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Wednesday, April 05, 2006

CAMBRIOS Wins EETIMES ACE Award - for Most Promising New Technology

Cambrios Technologies Corp. won the EE Times ACE Award - for Most Promising New Technology for its development of bio-mediated materials that could transform electronics manufacturing by bringing chemical-based self-assembly techniques found in nature to electronics production.

ACE Awards winners were chosen from the hundreds of submitted nominees that were narrowed to a field of five finalists then selected by a panel of 18 judges from industry, academia and Wall St.

Sounds like folks are catching on to the potential of Cambrios' technology ...

Wednesday, March 29, 2006

Adherex Receives Regulatory Approval For P2 Dosing Schedule Increase

Adherex has received regulatory clearance from Health Canada to increase the dosing schedule of its Phase II study of single agent ADH-1 to once every week, from the previous dosing once every three weeks.

Adherex is also adding clinical test sites in the US. The ADH-1 clinical trial is presently being performed at six centers in Canada.

"Based on our experience from our North American and European centers, this more dose dense, weekly dosing schedule of ADH-1 has been well tolerated and is preferable from a pharmacology standpoint," said William P. Peters, M.D., Ph.D., Chairman and CEO of Adherex.

This P2 single-agent testing is designed to evaluate the anti-tumor activity and tolerability of repeated doses of ADH-1 in patients with lung, esophageal, adrenocortical, renal and hepatocellular cancers whose tumors express the molecular target N-cadherin.

The trial is now expected to enroll up to an aggregate of 100 patients.

Adherex expects the Phase 2 trial to complete in the second half of 2006.

more than enough to ponder the possibilities.........

Thursday, March 23, 2006

Japans NIMS Tsukuba nano materials lab group links

Nano Bio Device
Nano Device 1st sub group
Nano Device 2nd sub group
Nano Quantum Electronics
Atomic Electronics
Nano Synthesis and Engineering

Optoelectronic Nanomaterials

Electro Nano Characterization
Nano Synthesis and Analysis

Nano Characterization
Nano Function 2nd sub group
Nano Fabrication
Nano Function 1st sub group
Nano Function 2nd sub group
Nano Architecture
Nano Materials Assembly 1st sub group
Nano Materials Assembly 2nd sub group

Nano Materials Assembly 3rd sub group

Bio Nano Materials Group
Nano Quantum Transport
Extreme Field Nano Functionality
Nano Physics 1st sub group
Nano Physics 2nd sub group
Nano Physics 3rd sub group
Appointed Project Leader nano patterned media
Nano Quantum Foundry

NIMS Hybrid TEM dual ion beam FIB

Japan's NIM - National Institute for Materials - is Amazing

This Japanese National lab's Nanomaterials research web site is astounding.

Covers everything soup to nuts in just about anything nano materials related of substance. (I'll point out that those getting RSS feeds on PDAs might need a PC to get past the flash front page.) Most NIMS labs 10+? seem to have the requisite Scanning Probe Microscope. Each and every group has a narrow enough project focus complemented by notable bench depth of staff to persue their work with vigor.

There is enough description of each groups work to get a good understanding of the their respective emphasis of the research work.

I will be reading more from their pages in the coming weeks and will post interesting highlights.

From the quick glance I have taken, it reminds me of what Bell Labs used to be, but with the focus on anything and everything in nanomaterials - where the real action is in nano today.

As to more trendy nano PR - this has NONE - the research is ALL meat and potatoes.

VERY IMPRESSIVE.

Tuesday, March 21, 2006

Curious about relative importance of parasitic resistance in polymer and solution dispensed nanoparticle PV cells

I keep thinking over how it might be possible to raise % efficiencies in polymer or nanocrystal liquid dispensed PV cells. I spoke with a close friend of mine, a Carleton University EE alumni, who is very skilled in semiconductor physics. I am of more modest skill in semiconductor physics (esp. at a quantum level) but often times I see what others seem to miss in process / device technology.

He brought up the salient point that any nanocrystal embedded in a weakly conducting (polymer) semiconductor will inherently be at a significant disadvantage as compared to more conventional monolithic grown or pulled semiconductor PV cells, largely due huge increases in parasitic cell resistances, - active material to semiconducting PV resistances on a nanoscale and poor bulk contact resistances to polymer conductors / semiconductors.

Same goes for a dense conglomerate of nanoparticles being of higher contact and bulk resistivity than a solid of similar materials.

My short conclusion in the interim is that several noted efforts seem to be technically weak mostly due to an "achilles heel" of parasitic resistances being excessively high.

His and my interpretation re desires to improve conversion efficiencies based on the nanoscale convertors alone, is that this possibly misplaced focus will miss the key point that the resistances are seemingly overwhelming as key issues, and not per se the convertors themselves ( at a nanoscale ).

While much protestation to the contrary is implicit due to the recent scientific coverage focusing on the nanoparticle convertor materials, by several well and even superbly credentialled folks, I have some doubts as to the merits being claimed.

It is clear that Quantum Dots ARE important, but the systems level cell materials issues ARE important - even equally and possibly more so. IE you can innovate in the Qdots and miss on the cell nano/microscale integration (ohmic losses in particular).

Cyrium's quick work with superb conversion results is a strong data point in support of my argument - they have done fantastic nanoparticle based PV conversion engineering and have by merits of the monolithic EPI growth, no high parasitic resistance issues common to Nanosys and Konarka - by Cyrium's best in in class materials choices...

And yes Cyrium's cells will not be able to be made roll to roll, nor on polymer, nor overall lowest in cell growth costs / area, in the foreseeable future, due to the issues related to EPI growth, but 39% conversion efficiency is nothing to sneeze at.

Can someone even come close in overall coversion efficiency by solution based nanoparticle / polymer PV convertors? Quite a stretch for now and possibly far into the future. Not impossible, but not likely yet.

Can Evident's wavelength convertors quantum efficiency, surmount the polymer / solution dispensed nanoparticle resistance issues? I have a degree of skepticism about that, until there are unusual huge breakthroughs in doping and conductances of polymer PV materials.

I may well be wrong, but I'd love to hear explanations why?

I also see one possible avenue to circumvent these challenges of parasitic resistance, but the process / materials issues implicit, are neither non-trivial nor without costs (ie how much closer can one get to Cryium's benchmark % eff, versus the cost increases in processing by some speculative means?)

The specific analogies one might infer, are that both Konarka and Nanosys's efforts which focus on the basic nanoscale particle convertor materials, in the hope that efficiencies will improve with careful but so far speculative experiment, might be missing the boat re the fact that fundamentally, conducting polymers (excluding metal particle doped "poly-mets" for obvious host matrix reasons) and especially semiconducting polymers, do not seem to be able to be produced with low resistivities in the range of the typical 0.5 ohm-cm seen in best in class silicon cells (nor approach the low contact resistivities of silicon or CS pv cells either).

Or do I have my figures wrong here - esp re semiconducting resistivities and with good low ?ms range carrier lifetimes?

I am curious as to readers' thoughts on relative importance of nanoparticle intrinsic photoconversion quantum efficiencies versus the "nanoscale through microscale" resistive losses? PLEASE SEND / POST COMMENTS ...

This may well be a significant and possibly fundamental stumbling block to advances in solution processed nanocrystal type photovoltaic cells and polymer matrix hosted alternative photovoltaic convertors.

I'd hazard a guess that due to the properties of CIGS materials, this does not apply to NanoSolar's roll fed nanoparticle CIGS process. Despite the CIGS particle suspensions used as precursors, the material appears to have already high conversion efficiencies, and I'd tend to partially attribute this to CIGS low material resistivities versus the more avant gard polymer or semiconducting nanoparticle cell technologies.

Monday, March 20, 2006

Solaicx - Photovoltaic Silicon Crystal Mavens


Pullers / Growers and Slicers of single crystal silicon Par Extraordinaire !

This hardy battle tested crew is doing useful commercial improvements to both the CZ puller and thin wafer slicing to reduce costs of high mobility single crystal silicon wafers with high volumetric utilization of boule silicon and improved process uptime for the crystal puller.

Key in their IP from a silicon crystal puller expert of the name Bender(an inventor for the firm), is that they have devised a means to stabilize the CZ puller with a near continuous feed replenishment of the melt, without disturbing the melt interface (nor displacing the surface) and identified useful methods to enable thinner wafer slicing for high yield production, by mechanically stabilizing the wafer and and saw blade.

Seemingly mundane technology, but important for thin wafer production desired for lower costs in high performance solar cell manufacture. ( ie if you are going to do high performance high volume cost effective cells, it has to be single crystal silicon for the foreseeable future - as Sunpower among others, seem to know well)


Boeing's Mach 3.5 ? Interceptor on the Tarmac



not a YF22 in 1957 ?? fat chance ...

Cyrium's 39% efficient Monolithic Quantum Dot Solar Cells




Dr. Fafard is on a Roll -

A Hearty Congratulations to Simon and his team for quick work of this crucial and amazing prototype milestone !...



Novelx Silicon Micromachined Electron Microscope






Novelx is a relatively new startup emerging into early productization of their SEM based on innovative compact Silicon Micromachined Electron Optics. The microscope is considerably smaller footprint than a typical scanning electron microscope, and has an excellent miniaturized Field Emission electron source and well designed electron optics.

The firm was founded by two talented industry veterans, Drs. Lawrence Murray and James Spallas with over 20 years of combined experience in miniaturized SEM columns starting back at IBM in 1990 and continuing on at Applied Materials ETEC division subsequently. Both are highly skilled in the microfabrication of specialized electron optics and design of same.

From their website.....

Novelx has miniaturized and driven the cost out of the core technology inside conventional Scanning Electron Microscopes (SEMs) to create a disruptive innovation. Our patented Silicon Stack Technology™ enables Novelx to build the Nano E-beam Engines™ that will drive innovation in a variety of nanotechnology applications including:

* Imaging - the viewing of nano-scale objects,
* Metrology - the measurement of nano-scale materials and features,
* Lithography - the writing of nano-scale features directly on substrates.



Novelx's first product is the mySEM™, a nano-scale imaging system that provides those at the cutting edge of discovery and innovation with low-voltage, high-resolution images of nano-scale objects. In the form factor of a desktop printer and connecting directly to a laptop computer, the mySEM is a breakthrough product technology. Novelx believes that seeing innovation drives discovery. Contact us directly to learn more about our products.



Powered by the Novelx Nano E-beam Engine, the mySEM electron microscope delivers nano-scale imaging capabilities directly to the desktops of individuals creating the next generation of innovations in nanotechnology. The mySEM is a breakthrough technology that is affordable while providing outstanding price performance in a compact design with an intuitive user interface. As easy to maintain as it is to use, the patent pending e-beam cartridge design ensures that your images are always the best they can be while avoiding expensive and unnecessary maintenance.

Sunday, March 19, 2006

CBC's Chasing the Cancer Answer - Wendy Mesley

CBC - Canadian Broadcasting Corporation posted an excellent series on Cancer called Chasing the Cancer Answers on March 5th 2006. Notable are the questions asked about prevention and the business of cancer. While the press more commonly obsesses about prospects for cures by new technology, this series is more down to earth in focus on possible causes and other interesting dynamics.

Here are the direct links to the articles

Chasing the cancer answer
Is cancer in our blood?
How blaming the patient is easier than prevention
The big business of cancer drugs and treatments
Consumer tips: Carcinogens to watch for
Key cancer questions in the chase for answers
Series Credits

Tuesday, March 14, 2006

EEStor.us KPCB's Ultracapacitor EESU Electrical Energy Storage Unit

EEstor is the stealth KPCB funded Ultracapacitor startup in Texas that is garnering a modest amount of blogsphere noise. Interesting firm founded by a team with considerable industry experience at Fortune 500's.

Rather than mumbling about noise I'd thought I provide the link to the Toronto Star article that covers them best AND a direct link to their main EESU ( Electrical Energy Storage Unit ) PATENT APPLICATION from USPTO. Note their silent website is www.EEstor.US

here is a direct link to the FREE full patent PDF at FreePatentsOnline ( my favorite patent site )


and the HTML ( text only )


The patent is pretty explicit in describing what they think they have and makes for an interesting read. I'll be looking over it in the next few days to see if there is anything unusual about the claims and pre-amble text that stands out as truly innovative. Obviously first by comparing to their cited prior art, as a good starting place. Noteworthy is that the Barium Titanate modified screen printable paste also has piezoelectric properties, curiously as it had been used in older technology piezo actuators...

here is an overview paper by UC Davis' Andrew Burke on Ultracapacitors.

Friday, March 10, 2006

Belcher Lab (cambrios tech mostly) BaISA related pub titles Bio Assisted Inorganic Self Assembly

2005
Biomaterials functionalization using a novel peptide that selectively binds to a conducting polymer
Biological scaffolds for the peptide directed assembly of nanoscale materials and devices

2004

Bacterial Biosynthesis of Cadmium Sulfide Nanocrystals
A method for coupled transcription and aminoacylation of cysteinyl-tRNA
Virus-based genetic toolkit for the directed synthesis of magnetic and semiconducting nanowires
Layer-by-layer surface modification and patterned electrostatic deposition of quantum dots
Development of a novel method for surface modification of synthetic polymer using combinatorial peptide screening technologies
Biological Routes to Metal Alloy Ferromagnetic Nanostructures
Fabricating novel biomimetic polymers using combinatorial peptide screening technologies
Virus-Based Fabrication of Micro- and Nanofibers Using Electrospinning
Molecular orientation of a ZnS-nanocrystal-modified M13 virus on a silicon substrate
Virus-based toolkit for the directed synthesis of magnetic and semiconducting nanowires
Genetically Driven Assembly of Nanorings Based on the M13 Virus


2003

Viruses as vehicles for growth, organization and assembly of materials
Optical anisotropy in individual CdS quantum dot ensembles
Synthesis and organization of nanoscale II-VI semiconductor materials using evolved peptide specificity and viral capsid assembly
Building Quantum Dots into solids with well-defined shapes
Viral assembly of oriented quantum dot nanowires
Virus-based alignment of inorganic, organic, and biological nanosized materials
Optical spectroscopy of silicon nanowires
Spectroscopy of individual silicon nanowires

2002
Making new hybrid bio electronic and magnetic materials based on nature's design
Structural and microstructural characterization of the growth lines and prismatic microarchitecture in red abalone shell and the microstructures of abalone "flat pearls"
Emulating biology: building nanostructures from the bottom up
Ordering of quantum dots using genetically engineered viruses

2001
Biomolecular recognition and control of nano magnetic and semiconductor materials

2000
Protein components and inorganic structure in shell nacre
Borrowing ideas from nature: peptide-specific binding to gallium arsenide
Selection of peptides with semiconductor binding specificity for directed nanocrystal assembly

Tuesday, March 07, 2006

AkuBio's Resonance Acoustic Profiler - vs Manalis' SMRs




So now there is a practical implementation of a microfluidic Quartz Crystal Monitor - QCM?

Despite all the effort and money into MITs Manalis' Suspended Microfluidic Resonant Detectors - SMRs, Akubio a spin off from the UK Cambridge University, founded by Prof David Klenerman, is simple straightforward microfluidic channel, coupled to what appears to be a conventional quartz crystal oscillator.

Product seems to be up and running and developing real applications rather than focusing on the microscale fabrication / integration, like Manalis is doing with costly co-development with IMT MEMS of Santa Barbara, of intricate complex micromachined MEMS cantilever SMR microfluidic structures.

All in all, the method of coupling fluidic channels to detection / excitation oscillators is useful for studying chemical and biological effects / interactions. But rather than initially focusing on the MEMS as Manalis is doing, Klenerman's Akubio Technology is doing the right thing, which is focussing on the applications.

Yes one could do all kinds of handwaving that the real emphasis should be on making a small disposable in MEMS, but anyone with a good business sense would agree that critical is applications development for real uses, and a MEMS centric effort will not have enough effort placed on developing critical value added end use applications.

Right out of the chute, here are 3 classes of APPLICATIONS AkuBio is supporting in Life Science Research -

Protein Characterization
Resonant Acoustic Profiling enables the real time label-free analysis of molecular interaction kinetics and affinities by measuring the change in frequency and resistance occurring on an oscillating quartz resonator due to surface binding events. Here we outline the basic principles of this powerful detection technique and review the key steps of analysis.

Antibody Concentration & Antigen Cross-Reactivity
A number of methods are currently available for measurement of antibody concentrations, including colorimetric assays (ELISA, Biuret, BCA, Bradford), densitometric methods, and amino acid analysis. Unfortunately a variety of limitations associated with these techniques (long analysis times, lack of binding specificity, label interference), makes their use in certain situations non-ideal.

Resonant Acoustic Profiling technology overcomes these issues by directly measuring the specific binding of antibodies to target proteins. The assays are label free, rapid, and can be designed to measure only active protein binding. Here we present protocols for the determination of antibody concentrations and characterization of antigen cross-reactivity.

Affinity and Kinetic Characterization
Resonant Acoustic Profiling enables the real time label-free analysis of interaction kinetics and affinities for molecular binding partners. Here we present a method for the accurate measurement of the affinity and kinetics of the interaction between the small human protein myoglobin, which is widely used as a cardiac biomarker, and its corresponding monoclonal antibody.
..........................................

Sounds like a sensible start to a technology, which later after sufficient applications development, will then warrant focus on microfabricated integration, but hardly at the start is the cost and effort for complex microfabricated cantilevered microfluidics worth the effort. The end use focus has to come first - to be market driven so as to avoid more costly errors.

END OF POST

Tuesday, February 28, 2006

Konarka's probable Austrian development arm

this research unit at the Uni Linz in Austria seems to have connections to Konarka. It has a wonderful list of online publications, dissertations and annual reports.

LIOS - Linz Institute for Organic Solar Cells

http://www.ipc.uni-linz.ac.at/os/index_os.html
http://www.ipc.uni-linz.ac.at/publ/LIOSpubl.html

and online video lectures by Prof. Heeger on polymer electronics

http://www.ipc.uni-linz.ac.at/os/HeegerLinz.html

Excellent reading and insight into one probable strategy of Konarka's development.

Wednesday, February 22, 2006

Compact Photonic Integrated Optical Circuits - Hybrid PhC Conventional Waveguides

One aspect to photonic crystal research that puzzles me greatly, is why it is commonly (wrongly) thought that PhC's should even be contemplated for general waveguiding use in integrated planar optical waveguides.

PhC's are nothing more than an extension of the concepts found in conventional thin film multilayer filter mirrors, but to the 2nd / 3rd Dimension. What is trivially evident in waveguiding applications, is that the nature of the granularity of micro/ nanofabricated PhC's is such that it is intrinsically "rough", filled with scatterers, as one might call it (apparent when one has critically trying to smooth the roughness of more common planar integrated optical dielectric waveguides for ultimate in low loss optical waveguide transport).

So it is unclear how PhCs might have benefits for general waveguide transport in integrated optics - since at first glance the basis for the structures - appears more like a scatterer than one might want to contemplate for use in optical waveguiding. And scattering from waveguide edges, results in lossy waveguide optical transport. This is not to disparage use of PhCs as integrated optical elements (as discrete integrated optical components in an integrated optical circuit), but it would seem intuitively that PhCs might have little promise as more general optical waveguiding transport elements.

I had the pleasure of working for an innovative professor at University of Alabama - who was very strong in computation of EM first principal effects in dielectric optical waveguides and PhC's.

Prof. Greg Nordin, who had the very sensible idea to do away with PhC's in the straight and simpler low bend radius optical waveguide sections, so as to reduce overall WG losses !!!

But still use PhC's novel capabilities in turning, filtering, splitting - for very compact integrated optical elements. Love it.

Prof. Nordin, now at BYU, is a perfect gentleman - smart as a whip and with profound insight into integrated optics and computational modeling of waveguide structure properties. He understands the proper use of novel structures in integrated optics and is an active researcher in design and computation of Photonic Crystal structures.

He has profound interest in small bend integrated optical structures - Air gap turning mirrors and optical ring like resonators and similar, made of air gap mirrors, both in modelling and nanofabrication.

CONT'D - click READ MORE.... for the full scoop.











Tuesday, February 21, 2006

Who was this Famously Accomplished Computer Designer




















1] Who is this most accomplished CPU designer,
SEYMOUR CRAY

2] How many computer firms did he take part in, ( and the cities where he did his work )
SPERRY /UNIVAC, CDC - Control Data, Cray Research and Cray Computer - 4, mostly minneapolis, Chippewa Falls WI, and Colorado Springs Colorado

3] What was he most famous for in a particular feature of his hallmark computer architecture, -
Vector Floating Point Arithmetic units - SIMD - Single Instruction Multiple Data (the basic element to early supercomputing)

4] What unusual method did he have of CPU design methodology, -
circuit designs were written up as boolean equations both for custom ICs and for each circuit card in the computer, and field engineers never had classic schematics - just pin assigments to the boolean logics descriptions of computer cards

5] What were the sad tragic circumstances of his unfortunate passing.
He was killed in a triple rollover of his Jeep Cherokee when hit by a drunk driver crossing headon into his lane in Colorado. The Jeep Cherokee he was driving had as standard for this vehicle no support for the roof that could sustain a rollover force (nor any custom rollbars). The roof was crushed and he sustained brain damage contributing to his death from the crash. Absolute tragedy of monumental proportions.

Sunday, February 19, 2006

EPOCAL's Medical Lab Diagnostics on an active Microfluidic Smart Card


Epocal, a microfluidics health care diagnostics firm founded by Dr. Imants Lauks, is building a novel compact microfluidics blood diagnostics on a card, for wide deployment in health care facilities.

Dr. Lauks previously was the founder of i-Stat, later acquired by Abbott, whose biochip based products provide hand held solutions for a number of critical care assays, including: Blood Gases, Electrolytes, Chemistries, Coagulation, Hematology, and Cardiac Markers (cTnI).

Epocal is noteworthy for its vertically integrating microfluidics process / manufacturing capability with medical chemistry applications expertise.

Where the i-Stat's devices seemed to be mostly passive dedicated substrate sample chips, the Epocal solutions will be lab on a card ( smart card format with integrated active microfluidics, sensors and reagents ) deployed to be measured and logged on small Epocal card readers in the hospital floor setting.

No muss nor fuss - all the wetted parts - channels and sensors and pumps, are on the disposable cost effective smart cards.

CONT'D - click READ MORE.... for the full scoop.


Noteworthy is the development at Epocal of smart microfluidic card manufacturing on flex - ie roll to roll substrates. And leveraging the considerable infrastructure / industrial tooling of smart card manufacturing.

This - use of mostly industry standardized smart card manufacturing tooling - is rare for recent attempts to commercialize biotech microfludics diagnostics, especially noteworthy for being readily available off the shelf from numerous vendors.

Epocals Biosensors-on-Flex™ technology processes kapton flex circuits into biosensor arrays in a single continuous roll to roll manufacturing process.

Epocal uses Roll to Roll processing - from raw material manufacturing start, all the way through to finished diagnostic card ready for shipment and use, with rapid throughput in manufacturing.

Roll to Roll Flex circuits are processed using machinery modifed from standard smart card manufacturing, on standard tape-on-reel tooling

Epocal's smart flex substrate cards integrate all active and passive microfluidics to eliminate the need for external pumps, detectors, reagent cartridges etc.

This is a practical manufacturable commercial implementation of micro TAS - Total Analysis System, with a large targetted focused market - hospital blood chemistry tests - test results faster and cheaper than ever before.

The flex kapton based smart card module, forming microfluidics with through vias and back-side metal, is the platform for a generalized biosensor micro Total Analysis system. Each card film via through hole pocket, when loaded with membrane or chemical reagent, implements a microscale bioreactor with integral electrochemical detector.

Membranes and reagents are loaded by roll to roll process integrated micro-dispensing onto the 35mm tape carrier, resulting in the lowest cost solution of any integrated biosensor technology.

Epocal has developed membranes and reagents for application in blood tests that include electrolytes, dissolved gases, hematocrit, and metabolites. Epocal's initial product will be capable of 8 tests, later expandable to12 tests per card.

My take is this firm will be another blockbuster from Dr. Lauks - comparable but likely better than i-Stat became.

Watch for Epocal.....

Saturday, February 18, 2006

Intel's Superb IC Manufacturing - the Best Bar None

hmm.. How many ways can one wax poetic upon the best in the business?

Intel's technical discipline, expertise, visionary technology developer, and overall well managed business is well known, but often misunderstood in the true depth of the astounding diversity of strengths.

CONT'D - click READ MORE.... for the full scoop.

Despite minor ups and downs (no-one escapes this), Intel has an astounding track record in developing and manufacturing the worlds most advanced Integrated Ciruit microdevices of unprecedented density and speed, at unparalleled manufacturing volumes. Bar None.

While scientists are impressed by raw technology, notable is that Intel is not merely among the best, if not the best microfabrication technology development team in the world, but can turn visions of the future into tangible reality, on a manufacturing scale no other firm in the IC industry can replicate in the slightest. And never stop at drive to improve performance on a scale others cannot come close to.

Intel's list of worlds firsts in novel technology, starts long ago with the now forgotten 1103 nMOS Dram memory - a 256 bit memory built on 2 inch silicon wafers.

A little known fact about the then revolutionary 1103, is that this 1st MOS memory device was the key to the revolution in GUI Personal Computers - it was the system memory device used in the Xerox PARC Alto graphical interface computer, the conceptual foundation of the personal computing paradigm in use today.

The seeds of Intel's success were found in the tenacity of Intel's team in the days of the 1103 - a take no prisoners approach to process problem solving, to make the promise of dense MOS digital devices a tangible commercial reality, beyond visions in theoretical papers. The struggle for yield in the early days of this key device was indeed a struggle and a test of team character.

There was one person who made all the difference in the 1103's early yield improvement - persisting in the face of challenges, and all kinds of pressures. He knows who he is, a modest, friendly and unassuming fellow who put the critical yield improvement brick into place that let the 1103 find its success. The future astounding commercial success of MOS IC technology followed, with the proof of the 1103's market storm, revolutionizing both dense computer memory technology and computers themselves.

Aside from the 1st commercially successful MOS devices, the 1st microprocessor, and the first EPROM (electrically programmable ROM) there are a multitude of device and product technology firsts, born from this unquestioned leader of the industry.

The evolution of MOS technology has largely been driven by Intel's vision and drive to suceed, focused, persistent, and relentless in intent. And may they keep at it, into the age of Nano now upon us, with all the success due the firm and its hardworking, astoundingly talented employees and management team.


Friday, February 17, 2006

Biocryst & Peramivir ( H5N1 ) High Hopes of a fix for Paranoia

I think it worthwhile to note that while some are tongue in cheek promoting "cough" hysteria about Biocrysts (premature) solution, to the yet to be seen pandemic H5N1 influenza, it is important to note that Biocryst's H5N1 candidate Peramivir - just recently approved for fast track status by the FDA, has the following track record.

CONT'D - click READ MORE.... for the full scoop.

In a prior Phase 2? orally adminstered testing of Peramivir, apparently Johnson and Johnson pulled out due to no statistical difference of viral load in the human clinical study.

There is apparently later evidence that IM Intramuscular adminstration of Peramivir is 5x more effective than oral adminstration ( ie comparable to 5 days of Oral Peramivir ) and this apparently is what the FDA fast track is based on - ie rapid clinical testing of IM injected Peramivir.

The skeptic in me indicates that if NO beneficial effect was previously observed in Phase 2 oral testing, why now the optimism of efficacy of Peramivir in injected form against permicious H5N1? ( ie... Is 5x of greater effect of no prior statistically observed benefit, going to get us something which is effective?)

Granted intramuscular injection might remedy limits to absorbtion in oral adminstration, but I am at least slightly puzzled about this. It is curious all the hullaballo, especially the present aproximate $500m valuation of Biocryst in this mildly speculative context.

Fast tracking something that has no demonstrated benefits in prior Human clinical testing is curious. Granted the potential risks from H5N1 mutation crossing over to a virulent form is considerable, but this is an unusual strategy.

One can make some inferences regarding how this transpired, but I will leave this up to the reader.

I think it also worthwhile for the reader to click on over to a saner perspective on potential (or not so potential) for a human H5N1 pandemic. The sky has not fallen yet. Check out this and this for an interesting read.

None the less, some balanced caution is warranted as precautions as to how to deal with emergence of a possible H5N1 pandemic.

Thursday, February 16, 2006

On the Delay / Cash Needs of Solar Cell Startups Miasole and Others

re SiliconBeat's 2/15 post on Solar Power Startups Taking More Cash & Time

hmm... well this gets interesting. Most anything BUT silicon for solar cells comes with all kinds of baggage - higher costs, more complex (and even speculative) chemistry, real risks in RESEARCH that properly are not typical of a good startup's product focused mission.

I think a few famous VCs have voiced that startups are best not R&D outfits, but really lets leave it at startups not properly being speculative materials research outfits. Basic novel materials development, due to its typical long gestation cycle, is best an Academic R&D endeavor funded by the government.

For all the disparaging of silicon, like in any process endeavor, Silicon photovoltaics are easiest to develop incrementally at lower risk due to well known materials properties and modest processing costs. Excessive risks of alternative PV materials are to be viewed warily or at least skeptically, as the costs of startup failure are substantive, unless you have the golden parachute.

I am not proposing here that garden variety silicon wafer cells are worth the time of day to start a firm, but I am firm a believer in the probability that a silicon material based PV startup will have a better chance of "Crossing the Chasm" and surviving.

CONT'D - click READ MORE.... for the full scoop.

CIGS cells which are made quite successfully in the lab are mostly still too expensive to fabricate at competitive costs unless you have the skills from the ETH Zurich labs where they have figured out how to get CIGS on polymer film substrates at efficiency of around 13%, which is pretty darn good. Hard panel processing of CIGS - whether on rigid boards or flex steel, is not a value proposition, nor compelling market entre longer term.

And specifically Miasole's CIGS (Copper Indium Gallium Selenide) (originally) using a stainless web, roll to roll processed substrate, is fraught with materials and processing challenges. They sputter the multiple CIGS layers and likely heat, as all have to do for optimal CIGS activation - and in a large stainless flex substrate, there are both thermal non-uniformities and probable high TCE thermal expansion mismatch - creating challenges for adhesion of the sputtered film and potential for cracking. Not to mention that the web feed for roll to roll has to be optimally designed for both web transport and avoiding cracking of the sputter deposited CIGS.

Now there are a few more subtleties involved - Miasole's earlier long gone web site showed both a novel in house designed rotating tubular sputter cathode (for optimal materials utilization in sputtering) and the need to do laser scribing and pneumatic shear cutting of the web to make tiles for voltage cascading. Quite novel, but each has its own artifacts to take due care with. I think their patents also describe some of this...

Typical industrial laser scribing is done with YAG ~1um wavelength Q-switched lasers to ablate or cut a thin film. The thermally conducting steel is going to heat sink the YAG power and not help with clean layer ablating, desireable for good electrical isolation after laser cutting, at least with a YAG. You can use an "athermal" Excimer laser ( shorter wavelength and much faster pulses ) but at much greater capital expense and slower throughput.

Shear cutting the sputter CIGS on flex stainless steel is possibly going to induce edge damage to the CIGS layers - either CIGS cracking in vicinity of the shear cut of the metal, or possibly shorting the CIGS layer at the point of shear ( as they showed it in their older web site, but did not describe the technical issues to implementation) . Moreover if one wanted to clear the CIGS layer away from the point of metal cut / shear to before the shear cut, to minimize these effects of damage to the CIGS, it will be more costly laser processing, with the same issue of the laser cell shaping they claim they use.

Now another comment re Miasole, the custom novel sputter cathode design they said would reduce costs, is a fairly complex cathode, and not available off the shelf from a vendor. Designing your own novel sputter cathode is not what you want to spend any time on initially, until the rest of the process works to produce a reliable manufacturing process. Any diversion of any effort away from fast prove in of a new cigs / substrate / manufacturing flow, to acheive needed relaibility, yield and stable device characteristics, is a distraction in the realm or priorities for a solar cell startup in development. I suspect this was underestimated, and while the cathode technology is cool, it is not critical path for shipping a product. FOCUS FOCUS FOCUS...( ie keep your horse blinders on the main goal, to not stray from the path well travelled)

The recent Iowa Thin Film Technology - an excellent a-Si on wide web polyimide film, is partly derived from prior a-Si R&D work, and seems to have perfected production scale a-Si on roll to roll, in larger capacity than ever seen before. Marvelous practical advance done on production scale web processing, end to end roll to roll apparently, which is the real challenge for cost reduction. And shipping in volume - you guessed it - using silicon materials.

I'd also point out that SunPower has perfected the astounding art of cost effective high efficiency (20%) single crystal cells and done so with exquisite engineering over many many years of expert work of Dr. Swanson.

Another innovation success in silicon is Evergreen Technology, whose core manufacturing technology - Edge Fed String Growth ( of poly xtal silicon ) is a very decent advance in low cost silicon, that is partially derived from a comparable but less efficient process out of Schott Solar, modified by Prof. Sachs of MIT to be more efficient in poly use and require simpler strip cutting rather than complex cutting of the hollow Hex drawn shape from Schott. Evergreen is ramping thin silicon cells now in a new $30m 2nd production plant, and still improving their machine technology.

I am not disparaging the efforts of Konarka, but I will definitely say that despite the obviously stellar scientific and management team, it is unclear if they are really advancing both cell efficiency and product lifetimes to commercially viable levels in the novel polymer technology (with Evident's R&D phase wavelength convertors).

Same can be said with Nanosys's CdSe branched tetrapod nanocrystal based cells. Will these ever get enough efficiency to warrant the effort and speculative capital being put into the Solar PV effort at Nanosys (in a reasonable amount of time)?

( 7pm Friday feb 17th ....entry for Nanosolar is previously incorrect re polymer web - and they are using "relatively conventional" CIGS materials but in a rather novel ink dispense on roll to roll .... more to follow later this weekend - pointed out by Jeff Kaplan) ......
And yet another novel materials foray is by NanoSolar with their ink based CIGS photovoltaics on roll to roll inexpensive unnamed ?metal web ( not stainless which is the typical CIGS substrate ). Has Nanosolar attained the needed reliability and conversion efficency? Apparently the case. Their process is a novel ink dispersion of CIGS, which is more conventionally sputtered, but this at least starts with decently understood PV conversion metallurgy..and their likely metallic web material is apparently considerably elss expensive than stainless ( per their released info )- so they both eliminate costly sputtering and are using a much cheaper substrate than the conventional stainless used most typically with CIGS cells. A curiously innovative and seemingly good effort. [ ANOTHER NOTABLE point is that Nanosolar states on their web site > that they are not presently accepting new capital ! This is a hopeful indication that they have likely made excellent progress !! ]

The jaded fellow I am, from 22yrs of real process engineering (not merely some fancy academic lab) says that basic science breakthroughs are not properly the domain of startups unless you have an unusual balance of team science, production process expertise ( not turn the crank mfg) and extremely rare fluid team problem solving that occurs faster than can be managed "conventionally" or predictably.. One has to be very fleet on one's ( team's) feet intellectually, to make rapid breakthroughs in the context of cost effective manufacturing with new unproven materials.

Had either Konarka's or Nanosys' PV efforts had benchmarked at reasonable 10+% conversion efficiency, - all for product worthy lifetime, reliability and yield, previously in the academic setting where originally persued, then it would be acceptable risk for a startup to launch production and then push beyond 10% efficiency threshold at Konarka and Nanosys concurrent with manufacturing. Miasole's challenges lay only in the yield and reliability I would gather and not likely in cell efficiency.

There are exceptions to this skeptical realism, but examples of basic research success in materials, in a time and cash flow critical startup environment are rare, mostly because management of breakthroughs in basic technology is a fine and rare art, and even rarer at startups, and even rarer in basic materials innovations.
( See Gargini's wise words for R&D )

enough said.

Tuesday, February 14, 2006

Lithography shrinks - % Line edge roughness is getting hairy edge

One of the main challenges today in advanced deep submicron (say 45nm) litho is not merely minimum feature size, but acheiving tight linewidth distributions.

If you take a peek at the Intel picture at their site - small SEM pic of their 45nm SRAM memory cell at the Intel site, as a process engineer you can see that MOS IC scaling is getting considerably more challenging than one might otherwise predict, because the line edge roughness is proportionately larger than ANYTHING I have ever seen before in production.
( ed. the pic itself was removed from my site - but the link is good )

The implications of large % linewidth edge roughness, is difficult decreasing % parametric distribution contol (statistics with HUGE sigmas) and this keeps designers up at night to vainly try pushing speed bin yields. This underlying issue is likely why Justin Rattner (Intel CTO) was pleading for new CAD tools to cope with design tolerancing (when the parametric distributions due to % line edge roughness are growing as the process shrinks relentlessly)

My take as a process engineer is that something has to be done to improve the litho pattern transfer, and I suspect it might be EUV, unless this pic of the ram cell is already patterned with EUV litho?

CONT'D - click READ MORE.... for the full scoop.


Or possibly the dry etch nanoscale uniformity / roughness, which at this nm level can be either the dry etch OR the nano-scale morphology of the gate electrode thin films. All in all, fascinating process detective work opportinuties. I'd love to fix this and to hell with the CAD solution. It is root cause a process issue.

MY guess this is keeping many folks up at nite to figure out some more pragmatic solution for 45nm production with tight parametric control needed for predictable circuit design performance.

POSTSCRIPT Feb 15th 2006 - the other interesting aspect to this, is that the image posted by Intel of the 45nm SRAM cell, is a SEM [Scanning Electron Microscope] image. Despite the hullabaloo about AFM metrology, when SEM electron microscope instrumentation is up to snuff, and well designed, no AFM can come close to the speed, accuracy and calibration stability comparable to that acheivable with the best electron optics imaging. It is quite telling that Dr. Mike Kirk, formerly a senior scientist at Park Scientific, is nowVP of the high end imaging & metrology business line at KLA-Tencor, per a recent EE Times news release about the latest SEM metrology tool being fielded at the firm.

Article on the genesis of Adherex Technology - novel safe cancer pharmaceuticals

Prof. Orest Blaschuk, McGill University
founder of Adherex and a most prolific inventor


Originally from the Ottawa Citizen, by James Bagnall, this superb article describes the early days of Adherex, its merger with Oxiquant and moreover a succinct description of why Cadherin antagonists have such astounding promise as cancer pharmaceuticals - safely destroying a useful % of a targetted class of solid tumors, with few to no side effects, nor any toxicity observed in phase 1 FDA (where a large tumor was apparently completely destroyed). on AMEX on TSX

Monday, February 13, 2006

Finally SWNT ( single wall carbon nanotube ) Forests might find a novel performance application


Prof Joel Schindall leads the way.

The application & performance seems promising, and not semingly daunting to build, yet leverages the ease of high surface area to volume for nanotubes seemingly quite simply.

Are there any issues in the device structure fab, outside of the SWNT nanotube forest growth
which is pretty well understood.

Can this be made cheaply enough to find a nice market of decent volume and profits?

When will real devices make it out ?

Sunday, February 12, 2006

MSN SEARCH - it Indexes Blogs Nicely .....

Saturday, February 11, 2006

Another Puzzle - this time Thin Films Related

Glancing Angle Deposition (GLAD)

Colorized SEM collage with permission of Prof. Michael Brett University of Alberta
Description & pics below with permission of Prof. Kevin Robbie Queens University

CONT'D - click READ MORE.... for the full scoop.

Glancing Angle Deposition (GLAD) is a technique for fabricating materials with controlled structure. It is based on thin film deposition, by evaporation or sputtering, and employs oblique angle deposition flux and substrate motion to allow nanometer scale control of structure in engineered materials.
The substrate is oriented at a large oblique angle relative to the incident vapour flux (a > 75). This leads to an effect called atomic shadowing and results in a porous structure with isolated columns of material growing toward the vapour source. The substrate is then rotated or tilted during deposition to engineer desired microstructures.



Atomic shadowing occurs when oblique vapour flux is shadowed by previously deposited film material from reaching areas on the substrate. These areas are shadowed. If the mobility of the atoms on the surface (adatoms) is limited, there is no growth in the shadowed regions. This results in the porous inclined microstructure observed in oblique deposition.




This figure shows the fundamental techniques used in GLAD with MgF2 films deposited on Si or glass. All 4 films were deposited with the polar flux angle a equal to about 85 degrees. In a), the substrate was held stationary and the flux arrived from the right for the entire deposition. A porous inclined microstructure resulted. In b), the direction of arrival of the flux was alternated from the left and right 12 times during deposition. Note that the polar angle a was kept fixed at 85 degrees for the entire deposition. In c), the substrate was rotated continuously during deposition. The film growth was always toward the vapour source so this resulted in a helical structure. A feedback control system was used to adjust rotation rate to accommodate for varying deposition rate and achieve constant pitch helices. In d), a combination of the techniques used in b) and c) was used. The substrate was rotated in 90 degree steps during deposition. A short pause for deposition followed each 90 degree rotation and the resulting structure is a 4 sided 'square helix'.


Effective Yield Improvement in Semiconductor Manufacturing

Good Habits for Yield Improvement Engineering
List in no Particular Priority
( ie this is NOT your Mother's Yield Solutions Overkill )

CONT'D - click READ MORE.... for the full scoop.

1] GATHER INFO - Anecdotes, Data, listen to opinions[every last one till you are bored 5x over, even from the 2nd shift operator], observe and dig, till your fingernails are ragged bare.

2] MAKE NO JUDGEMENTS YET - be a good, even great listener

3] Do not hew to unsubstantiated preconceived ideas YET, no matter who says it ( same as 2])

4] MAKE LISTS ( bigger the better & then prioritize ) - some call 'em Fishbone.

The former Director of Hitachi Central R&D labs, kept his low yield hypothesis list, on a single 3x5 unlined index card - as a dense list of brainstorms and corresponding hoped for tests of validity. Fishbone diagrams per se, are often merely tools for the inexperienced, and those too stiff to really brainstorm enjoyably.

It is the list writing and reflections thereupon continually - that matters and something of character - leave no stone unturned, as you never know what the cause is, until proven by a working process FIX.

I'd make the same case for over obsessing about Xbar R, process trend charts - the most important thing is to use them, not obsess about the numbers, but to look at the trend data continually and skeptically as to "your process' stability", and check potential root causes. Xbar R is a window into the soul of your processes and read it carefully.

5] View everything with a healthy dose of skepticism, not cynically, but ANALYTICALLY.

My best Fab Wide yield fix (+20% increase, to return a showcase bleeding tech - crashing fab to "normal yield") occurred in spite of "substantiating" data indicating the REAL SOURCE of yield loss - was "purportedly guilt free".

EVEN numerically correct experiment analyses, can lead to making WRONG conclusions.

A T-Test "proved" innocence, BUT a MINOR REALITY CHECK INTRUDED - the experiment design did not account for a critical process integration matter which rendered the T-Test results INVALID as interpreted.

TRUST BUT VERIFY, not to be mean to others, but to UNDERSTAND the experiment, data and purported conclusions.

EVERYTHING HAS CONTEXT, and context has bounds or limits to interpretation.

6] DO LITERATURE SEARCHES when you are in need of fresh ideas - not some trite 1 marquee article and call it a day. READ dammit.

7] CALL VENDOR APPLICATIONS EXPERT"S", and drill down through organizations until you get what you really need, not to feebly fob it off as "the sales guy did not know".

Expert knowledge comes from experts, and the best help is often free, if you take the time to actually persue it with sufficient vigor.

And to really mess with you mind, once you have the expert opinion, sometimes do the opposite (not exclusively) since this might merely be conventional wisdom of an expert, but listen carefully just the same.

8] Mull all this data over, think, pick your best shot from your list of hypotheses, and run experiment (s) testing your hypothesis' validity.
Pass - collect the accolades.
Fail, go to the next best candidate on your working list.
Repeat as necesssary until you find the real solution, or give up prematurely, stumped in your quest ( hopefully it does not come to this ).

9] CHARACTER MATTERS, try your darndest, and search after real root causes with persistence and dogged determination.

Be your own best critic, not to be despondent when things don't work out as hoped for, but to be true to yourself first.

My own motto when faced with the seemingly daunting insurmountable task was "you can't hit a home run unless you first swing the bat" ( and I have plenty of strikeouts under my belt).

Don't pay attention to others' misconceptions, and browbeating, nor nitpicking, focus on the task at hand, like a horse with blinders on.

Swing the bat regularly with good intentions, and you will develop great problem solving skills (harder than R&D / inventing BTW)


and finally .....
10] NEVER GET YOUR CUSTOMERS DRUNK, to convince them to pay their bills.

One yield consultancy - quite prestigous, in the course of an interview, I asked - "How often do fab yield improvement customers not choose to pay?" and the response was "pretty frequently that they fail to belly up and pay their debts..."

So I then asked - "how do you get your customers to pay up when they refuse?" and the youthful hiring manager responded "I take the customers' managers out to dinner and gets them plastered enough to sign on the dotted line of their contract, while thoroughly soused".

Sad, and not quite ethical, despite the pedigree of the well known firm.

Thursday, February 09, 2006

Who is this Sage Giant Among VC Advisors to Startups ?

























and what are two ( among several ) prominent career milestones he acheived prior to calling silicon valley home, nevermind his near continual string of blockbuster startup hits ( and being universally well liked and immensely respected )?

END OF POST.....

What Role in the Dawning of a New Age of Science



do these two pictures relate to -
Who is she and
What precisely transpired that was significant and not given due recognition until much later?


END OF POST .........

Late 1950's MACH 2 Interceptor on the Tarmac

WHAT AIRCRAFT IS THIS?

END OF POST .....

What Echos of Cointreau is this YLEM ?


and what did it mean to the understanding of the universe?
( note to SJ - these pictoral puzzles are following in your fine FLIKR tradition except highly nano-ist in orientation )

END OF POST ...............

Who Is This ?





















Some might call him "Nemesis of Sand Hill Road"? and a very successful one at that - the distinguished Rider, who happens to be a very successful inventor, scientist and businessman.

The Horse, silly, is merely lucky, (ed. correction "was", as the Horse recently passed on) with his stable not far from the former Reagan ranch, on one of the larger spreads in the region ...

Wednesday, February 08, 2006

TETRAD of PhotoVoltaic Materials Strategies for the future

Things to Ponder

SILICON - variations on process & module methodology
single xtal, thin film and poly xtal, hot wire cvd and small chips, Prof. Sach's edge fed string growth, emerging/ speculative silicon nanowire and the superb engineering of Sunpower's sophisticated devices......and now a large scale 13" wide - roll to roll amorphous silicon on polymide flex at Iowa Thin Film Technologies AKA Powerfilm Solar

the cast of millions goes on and on...

CONT'D - click READ MORE.... for the full scoop.
POLYMER Photovoltaics -
Konarka
The best top flight VCs are betting on this.
The most prestigous board and advisory team.
1] founding scientists
2] industry advisors
3] science advisors
Based on names alone it will likely succeed.

And very notably, Prof. Heegers superbly prolific patenting is beyond merely impressive, an astounding personal ~60 career patents.

Kudos to Prof. Heeger !

Will a means be found to inhibit UV / environmental degradation needed for a competitive product life ?

Will it be possible to coax stable and usefully high PV efficiency from some as unknown EVIDENT materials solution? ( silly pun of mine )

Feb 14th Konarka announces another $20m funding round completed lead by 3i ventures, making a total $60m raised since 2001.

Stay Tuned .... ( again a silly pun only a photon would love ? )

NANOCRYSTAL PV conversion
Nanosys - seems to still be struggling with %PV conversion efficiency
as Konarka seems to be ?
Are tetrapods all they are cracked up to be?

Cyrium Technologies - Fafard's Nanoscale Self Assembled EPI Quantum Dot solar cells
Simon F. says he can hit in excess of 40% conversion efficiciency for space based cells, the real question is whether he will get bit by the bug for larger price sensitive markets and try to put some effort into a scalable production worthy terrestrial oriented PV device based on SA Quantum Epi Dots. Fafard is CNRCs quantum dot expert, and spent time in a post doc at UCSB under the ever fascinating and mercurial Pierre Petroff.

Cyrium does need to increase the size of the patent portfolio that is certain, as the firm is nowhere near the # of filings of larger competitors, but likely is that Cyrium's present funding is a notable constraint. Simon's core IP is represented in "Solar cell with epitaxially grown quantum dot material" United States Application 20050155641, which describes successively cascaded tuned QD PV elements merely grown epitaxially.

For now that is all that is apparent in the relevant IP posted at USPTO. If it makes it to an issued patent, this might be of considerable value, beyond the bond layer transfer tandem cells being studied at Caltech and elsewhere, merely on ease of manufacture, by avoiding the multiple bond layer transfer of this earlier innovation practiced at the Atwater Lab.

Technically at some point, the self evident paradigm to try, is to leverage the methods fairly recently implemented at Motorola for III-V low defect EPI growth on large silicon wafers, for his devices.

Question is whether Cyrium has motivation, interest or knowledge for how to do so. If yes to all 3, and one can acheive comparably high efficiencies on larger wafers from "mere" epi growth, question is, will this catalyze a larger terrestrial market and higher profits, when competing against for example SunPower's lean mean manufacturing machine? "Only a photon knows for sure ..."

Thin Film CIGS
Miasole
Promising but capital intensive ( almost unnecessarily so with the advanced custom magnetron sputtering cathode that was entirely unnecessary to be part of the complex critical path in the production process development - despite the appeal of high utilization cathodes, where was it impotant in determining the actual panel / module process flow - NOWHERE ??? and costly thin stainless substrates.

And it is likely that they made 2 Process strategy ERRORS. The stainless flex substrates have a host of implied problems - mostly related to singulation and possible edge shorting of the cell structure during singulation, not to mention adhesion / CTE mismatch issues in the thermal cycling for CIGS interdiffusion activation.

The described method of shear cutting the edge of the web steel, while it looks clean in cartoon pics, is risking serious damage to the junction integrity of the CIGs stack, unless a laser preclean is done to remove the CIGS stack from proximity to the sheared edge - but with still yet the remaining risk of shear induced cracking of CIGS in proximity to even a cleaned edge of the stainless substrate.

Furthermore laser processing of materials on top of stainless flex substrate is going to make the laser process window considerably smaller than desired due to high power losses to the steel (heat sinking), which is completely undesireable for a good industrial (yag) laser ablation process. And yes athermal fast excimer pulses will help, but at much greater cost than typical industrial grade YAG laser thermalized processing. And if you still yet need more process window - the trick will be to reduce the laser power required with reactive gas assist laser etching rather than purely ablation, while it may make a useful process window, will result in consdierably higher capital costs, nevermind some risk to the CIGS itself. So high thermal conductivity ( steel) substrates for web fed CIGS are coming with some considerable baggage technically.

Therefore, while steel has an obvious ( to those who have workd with laser ablation process ) serious set of disadvantages in process integration, the potential aesthetic and relaibility appeal is quickly lost in practice.

The means to slightly shift things in ones favor, is to carefully examine process windows and adapt materials to



and naturally in module integration is the ever present, tantalizing yet slightly fickle ....

Roll To Roll Processing
Nanosolar ( PV ink ) as a Paradigm for cost reduction for module formation and further mention to the "ROLL MASTERS" large scale 13" wide - roll to roll amorphous silicon on polymide flex at Iowa Thin Film Technologies AKA Powerfilm Solar



Roll to Roll has unique materials and structure requirements to acheive long life cells, and forces the manufacturer to look closely to find capable production equipment for end to end Roll to Roll.

RtoR sputtering is easy to procure std equipment for, but patterning / ? screen printing takes a bit more effort ) [ come to think of it - screen printing or resist litho & etch in RtoR, is almost silly - just go with Shadow Masked metal sputtering for the coarse PV interconnect features - with no need to etch, nor fire a screen printed paste ]

and more speculatively - will the Vitex Barix process find a home in environmental barriers in some of the more novel PV advances ( as it has been successful in OLED stabilization without the use of hermetic sealed packages ). This is something only an OLED pioneer might know?

musings to follow later .......


Sunday, February 05, 2006

Cambrios - Its Truly Novel NanoTechnology & Implications

article will follow in 3-6wks - describing technical strategies and some speculation on potential commercial implications of Cambrios / Belcher research. Let's call it Bio-assisted Inorganic Self Assembly ( ? BaISA ) "BahEeSah"

END OF POST .....

Nantero's Progress in Nanotube NRAM memory

From an interview with Nantero CEO Greg Schmergel on Feb 3rd 2006, Nantero's NRAM, is ready for a production roll out in 2007. http://www.tgdaily.com/2006/02/03/nantero_cnt_memory/

This is a pretty telling statement regarding progress made towards development of Nantero's NRAM memory. Something is happening, and it sounds good.

The NRAM technology is a nanotube based MEMS storage element that is formed from a "mems crosspoint" of 2 opposed matts or bundles of nanotubes, 1 suspended as a flexible (MEMS) Nanotube "strip", above the other fixed anchored carbon nanotube bundle below.



Electrostatic forces can cause the upper Nanotube bundle to move into electrical contact with the lower Nanotube bundle, in a non volatile state, but electrically reversible.

( shades of nonvolatile FLASH, but faster than flash, lower power and cheap as a technology node advance )

CLICK READ MORE... for rest of article.

While the device implementation is not as elegant at the seminal single wire pair Science publication concept by Nantero founder Rouckes, then of Harvard's Lieber Lab, in which was predicted NRAM feasability based on single pair, crossed nanotubes; apparently the implemented NRAM device of crossed BUNDLES of nanotubes, works very well and yields well.

YIELD is the key... (as always)

Long ago when I read of the Nantero start-up, I had some pretty emphatic emails with Jennifer Fonstad of DFJ regarding the near impossibility of single pair, crossed wire NRAM devices, to be able to be made with any yield. ( which still holds today btw AFAIK ).

Just a stubborn principled response from this grizzly process engineer, who has seen many claims before re paper feasability, become well, just paper, due to unwarranted optimism.

While the Rueckes paper in Science implied the feasability of single wire pair NEMS memory element, it was trivially apparent that the state of technology of catalytic growth of Carbon Nanotubes could in no way support successful fabrication of single nanotube crossed wire pair memory elements at ANY acceptable yield (which likely remains true to this very day).

Key is that tensioning of nanotubes in anchored tensioned pairs via catalytic wire growth ,was very much impossible, or not quite in the realm of feasability YET!(at the time of nanteros startup)...among other technical issues regarding encapsulation of single wire crossed pairs of nanotubes and so on...

The Science paper's device concept was very much not trivial to build at successful yield, apparent to someone who both had extensive microfabrication expertise, and decent knowledge of state of the art of catalytic nanotube growth - artifacts and all.

Single Wall Carbon Nanotube processing is fascinating, SWNT growth being basically a CVD process comparable in materials science fundamentals to the very old VLS - Vapor Liquid Solid growth, of silicon nanowires dating back to the late 1950's.

BUT as transpired, it appears that Nantero began to understand this limitation to the original vision of the single wire, crossed pair memory element's "commercial" viability, and struck out addressing the challenges needed to overcome to build a viable Nanotube based MEMS ( ok NEMS ) memory cell, without being fixated on Rueckes original concept. GOOD !

Despite the Science paper showing an ideal artist's rendering of the single wire, crossed pair memory element concept, it was very evident that catalytic Carbon Nanotube growth had difficulty to grow single tubes, point to point, under near neutral tension (critical for tight NEMS geometry control and to avoid weird buckling effects of the upper moving tube).

Additionally obvious was that any practical MEMS memory element, had to be encapsulated while not damaging the memory element. which for a single wire crossed pair was not particularly hopeful. (nor avoiding entrapping particulate in the encapsulation either)

Unsealed devices would never survive assembly singulation (chip dicing/saw), and it was not trivial to encapsulate single wire crossed pair memory elements....without damaging them in the process or making the device sensitive to sealed in particles. hmm.. food for thought.

Dropping the ideal vision of Rueckes' Science paper, was key to find a workable manufacturable device concept.

Presently the Crossed Nanotube Matts are polymer spin deposited (NOT GROWN) by a unique polymer formulation provided by Brewer Scientific - where the nanotubes are dispensed onto prepatterned IC circuit wafers in a Brewer Scientific polymer formulation, using pretty conventional PhotoResist wafer track equipment, to great success. At an appropriate time in the process, the polymer is removed (via dry plasma) - resulting in a crossed pair of nanotubes with a controlled gap, devoid of the original dispensing polymer.

(Hats off to Nantero and Brewer for this elegant practical technical advance).

2-3 lithographies seem to be all that is necessary for the cell formation of the crossed nanotube matts, and the multiwire MEMS cells seem to work very well. ( else production would be hard to contemplate )

Key in this "hybrid" nanotube NEMS memory technology, is that the bundles of nanotubes do not appear to have huge limits on the device performance or yield despite the nanoscale "cosmetic" appearance of the bundles.

All my respect goes to The Nantero Team of Rueckes, Schmergel and Segal, and Jennifer Fonstad of Draper Fisher Jurvetson, for sticking with this, until a working device concept could be found and implemented.

CONGRATULATIONS and BEST OF SUCCESS !

Ref - "Carbon Nanotube Based Non-Volatile RAM for Molecular Computing"; Rueckes, Kim, Joselevich, Tseng, Cheung and Lieber; Science Vol. 289, p94, July 7th 2000

p.s. now that I think of it, NRAM's concept actually seems modestly similar to the Iridigm iMOD device acquired by QualComm MEMS used for display applications - but where the iMOD is made from monolithic thin films for a reversible buckling light modulator, versus Nantero's nanotube based memory element. Both Nantero and Iridigm come out of the Boston area, with Iridigm having started back in the mid 90s by Mark Miles of MIT, targetting low power reflective displays at a larger scale of device structure, and not using nanotubes obviously.

And on a similar theme there is Prof. Bloom's Silicon Light Machines which was again a comparable concept of a suspended mems bridge for projection displays and light modulators, with his later follow on firm LightConnect in Newark making telecom mems optical modulators for dynamic gain adjustment / levelling in DWDM. PLus there is the contemporary Cavendish Kinetics MEMs embedded RAM that will have a much smaller Market than nRAM, mostly because of a less agressive market thrust and seemingly lower technology target than nRAM...

All closely related in device concept of a mems /nems crossed bridge structure - but for different applications and materials and size scales, with Nantero aggressively targetting the mainstream high density memory market, where the potential for large revenue is the greatest . Curious connections ...

Thursday, December 15, 2005

Fiber Based Laser Tweezers & NSOM Probes



Fiber based laser tweezer gently gripping a mollusk ~0.4mm long

Little known is that most efforts in Fiber based NSOM, use optical fiber probes which are inherently lossy - in that dielectric optical guiding is lost between the tip and the optical waveguide over a relatively large "characteristic length" between the tip apex and the beginning of the undistorted optical core of the fiber optical waveguide.

As a consequence, the metal clad glass tip will absorb a fair bit of light and in collection mode little of the light collected from the tip will actually enter into the dielectric core, resulting in little collected light from a Betzig style probe will make it to the far end of the optical fiber due to cladding losses

Most any Betzig style NSOM fiber probe used by most researchers in NSOM, will perform pretty miserably in optical collection mode, since the photons that enter the tip apex have a relatively low efficiency in making their way to the large enough diameter of the optical core that has not been distorted down to the tip diameter.

But there is a way to make 20nm sharp purely etched fiber probes, very consistently and with excellent collection efficiency.......

The same basic method of probe formation can also make a unique and superb optical fiber based laser tweezer, at much lower cost than a conventional far field focus spot laser tweezer...

PICTURES COURTESY OF ROD TAYLOR CNRC
( his works )

Sharp Tip Etched NSOM probe - note large optical core diameter at base of tip - critical for high optical collection efficiency in NSOM.



Fiber Tweezer Tip Detail - note divot in "tip" for Laser Tweezer gripping cells - NOT FOR NSOM



















Fiber Laser Tweezer Trapped Bubble in Liquid




The helical vortice from laser tweezer liquid heating




POSTSCRIPT Feb 5th 2006

An unspoken area of application for high collection efficiency NSOM Probes is for optoelectronic circuit diagnostics of advanced MOS devices.

There is a fair bit of activity in high speed optoelectronic circuit diagnostics by imaging using microscopy and hot carrier photoemission for (sub?)ps timing analysis using conventional microscopy at Credence in Fremont and their purchased technology from a firm they bought called Optonics a few years back. Theirs is conventional microscope optics to a ?gated ?intensified cooled camera in ?IR

A fiber based method would possibly beat far field imaging hands down for RT circuit node data extraction BUT the issue will be since this is backside imaged ( requires substrate thinning on a BGA flip chip like P4/ Athlon 64 etc ) the backside thinning will likely limit the effective optical path length so that spatial localization is not optimal ( ie not truly near field, but likely to be far better than microscope lens collection to a camera ).

None the less, ps optical emission circuit diagnostics are astounding and this might be the first way to try to make an equivalent modest cost quasi nearfield "photonic oscilloscope probe" All this is conjecture on my part, but I would not be surprised based on prior efforts in mems based nanoscale circuit probing that we see an NSOM based photonic "oscilloscope" probe in the near future based on the excellent collection efficiencies available with this kind of low loss NSOM optical collection probe. I suspect someone is trying this RIGHT now....

Feb 14th 2006

Curious thought - can an effective combined NSOM, AFM and fiber based laser tweezers be implemented? Basically this comes down to whether sharp tip NSOM AFM can properly implement laser trapping with correct / optimal light wavelength and power, without appreciably degrading the other functions.

CLICK READ MORE... for JOURNAL REFERENCES -


1) R.S. Taylor and C. Hnatovsky “Particle trapping in 3-D using a single fiber probe with an annular light distribution” Optics Express,11,2775-2782,2003.
2) R.S.Taylor and C. Hnatovsky “Trapping and mixing of particles in water using a microbubble attached to an NSOM fiber probe” Opt. Express 12, 916-928, 2004.
3) R.S. Taylor and C. Hnatovsky “Growth and decay dynamics of a stable microbubble produced at the end of a near-field scanning optical microscopy fiber probe” J. Appl. Phys.,95, 8444,2004.
4) P.Burgos,Z. Lu,A. Ianoul,C. Hnatovsky,M.-L. Viriot,L.J. Johnston and R.S. Taylor “Near-field scanning optical microscopy probes:a comparison of pulled and double-etched bent NSOM probes for fluorescence imaging of biological samples”,J. of Microscopy,211,Pt.1, 37-47,2003.
5) R.S. Taylor, K.E. Leopold, M. Wendman, G. Gurley and V. Elings, “Scanning Probe Optical Microscopy of Evanescent Fields”, Rev Sci. Inst., V69, Nr8 p2981
6) R.S. Taylor, K.E. Leopold, A. Delâge, M. Wendman, G. Gurley, V. Elings, "Near-field scanning optical microscopy", Physics in Canada 54 (2), 116-121 (1998).
7) R.S. Taylor, K.E. Leopold, M. Wendman, G. Gurley and V. Elings, "Bent-fiber near-field scanning optical microscopy probes for use with commercial atomic-force microscopes", Proc. SPIE V.3009, p. 119 (1997).

The Importance of Good Literature Searches and Reading to Solving Tough Technical Problems in Microfab

CLICK READ MORE... for article text. You cannot buy knowledge of the prior art, when undertaking difficult projects involving innovation or process problem solving.

You have to learn learn by reading patents, articles and dissertations as much as practical, where possible.

I have seen efforts of commercial works, large and small - diluted significantly by not adequately reading the literature when it was very much warranted. Yet, if you go about reading the literature in the wrong way, you will get early fatigue and not read enough articles.

By this I mean reading initially for too much detail / depth of the article.

Critical is that one has to read for techniques and methods and observation of phenomena, not as one might read line by line if you were a theorist. When a particular article is found that is especially relevant or useful, then dive in and read in much greater depth and slower speed until you feel you have gleaned all that you might benefit from.

Scanning literature quickly is an art, and must be done to begin to develop a sense as to the truth of what is being said, or its practicality or relevance, faster than one would take the time to read a publication line by line, tediously checking all the mathematics, and every sentence or phrase.

Once you read enough articles on a particular subject, you have hopefully gained perspective and the ability to apply some limited judgement of the relative merits of different methods and strategies in innovation, in the domain you wish to persue device development in.

Nothing beats good preparation.

the Bibles - References for Microfabrication

Thin Film Processes by Vossen and Kern
( especially Ch 6 Wet Etchants table by Deckker and Kern )
BTL Silicon Technology
Handbook of Chemistry and Physics

Ed Graper's ( Lebow Inc / TFI Telemark )
Table of Thin Film Evaporation - materials and properties

Dan Flamm's text on Plasma and RIE Etching

Cadherins and Looming Revolution in Cancer Treatment ( Adherex )

A little known but critical technical advance in the treatment / shrinkage of solid tumors is currently in development by a very small but very talented firm that is the merger of a McGill university spinoff and a firm ( Oxiquant ) founded by more experienced cancer treatment physicians.

Adherex Technology, originally from McGill has been working on its methods for applying cell adhesion compounds to safe and selective destruction of tumor vasculature.

Where is the significance one might ask? Plenty and it is not "run of the mill me too"....

CLICK READ MORE... for rest of article.

A rare drug candidate that has exceptional tumor selectivity, fast acting 30 minute basic effect on the particular ( n-cadherin ) marked soft tissue tumors, and what appears to be no upper dose limit to onset of toxicity found ( the ADH-1 compound is normally made in small amounts by the body ), and the compound is safely metabolized quickly in 4 hours with no traces found therafter.

Susceptible n-cadherin marked tumors can exhibit onset of safe tumor necrosis in 30 minutes of the ADH-1 compound being administered.

Sorry there is little press on the firm, but this comes from the fact that in Canada most of the press online is by subscriber only and archives are accessable only for fee and not google indexed.

As a result, few know about this looming revolution in cancer therapy, that is going to take the world by storm in a few years as it progresses through FDA trials. ( currently completed Phase 1 and into Phase 1B / 2 concurrently ) Phase 1 showed both tumor shrinkage and no side effects what so ever )

Besides this novel ADH-1 chemistry, Adherex is also engaged in developing an improvement to the chemotherapy agent 5FU to increase the probability of being orally adminstered, and improve patient endpoints, and reduce side effects, after eyeing a failure in Glaxo's efforts to do the same, and seeing where they could remedy the percieved errors in prior implementations.

Key technologists include Adherex co-founder Prof. Orest Blaschuk of McGill Urology and Dr. William Peters, president of Adherex.

Watch for this one.

http://finance.yahoo.com/q?s=ADH&d=t on AMEX and
http://finance.yahoo.com/q?s=AHX.TO&d=t on toronto

Trends in Scanning Probe / Atomic Force Microscopy

( NOTE - LIST IS IN NO PARTICULAR ORDER
Moreover if you are inexperienced in SPM the most critcal sauce in best in class instrumentation is

1] SOFTWARE - robustness of code, ease of re-programmability, nanolitho, # of useful features & max image pixel counts .... and
2] CONTROLLER HARDWARE - simplicity yet power through elegant feature rich designs.

There is only one firm with both of these criteria met in their core products.

The scanner and probe interests reflected in this post are somewhat avant garde - not yet reflected in commercial products, moreover with Degertekin's FIRAT, probe technology might soon become quite an interesting area as to innovation ...enuf said to the afficionados out there and there seem to many readers in the South Coast who know this obvious stuff well. ED. )

Faster imaging

Parallel probe microscopes commercialized
















( picture - by kind permission of Prof. Cal Quate of Stanford )

Softer forces

Sharper and duller tips
( controlled radius )

R/T imaging - bio & materials, in air and fluid















Ando's fast bio scanner


















Ando's Microscope Optical Detection Path



















( pictures of Real-Time Scanning BioMolecular AFM - by kind permission of Prof. Toshio Ando, Kanazawa University )

Improved stability conducting nanoprobes

Higher pixel count imaging
( like the best 4th gen uScope controllers )

Lower tracking servo error excursions
( less force error - reduced under & overshoot excursions )

Methods for commercial nanotube modified tips of good orientation and yield


Prospects for Nanoimprint Lithography in IC fab

Aside from the obvious fact of the advantages of the Molecular Imprints technology for nanoimprint ( from UT Austin ), the primary limiter for possible success of nanoimprint litho in near mainstream IC fabrication, is in the mask fabrication infrastructure for the sub 50nm ( typical 30-40nm ) features to make the technology transition worthwhile for commercial manufacturers stuck with expensive working DUV technology.

Any effort to commercialize nanoimproint litho is critically dependent on customers ease of finding sources for the small feature 1x NIL masks in a timely fashion.

And the most difficult aspect to make the ultimate in small features in quartz is that most RIE processes and etchers, designed for use with conductive substrates, and needing to generate surface biases to critically assist in etching the SiO2 of the Quartz NIL mask, do not generate adequate surface potentials due to capacitive coupling through the 1/4" quartz....

A quandry - and what to do????

there has to be some kind of solution to this technical challenge ???

Wednesday, December 14, 2005

The Strategic Importance of DUV Immersion Lithography













picture of an unrelated relic of the beginnings of IC litho production


DUV immersion litho is potentially the engine of 65nm and smaller IC lithography with no exotic EUV xrays and no need for 157nm calcuim fluoride lens materials for the reduction lens. Onwards to immersion ..

update Feb 5th 2006
- or there might be some competition nm precision with stepped offset double exposures... rumors of this abound for the leading edge production litho, prior to rollout of immersion tools for production. Apparently Intel does not use immersion yet, and the 65nm process is actually producing 35nm wide physical gate lengths ??? HOW is the question, and double expose with precision stage offsets is one way to do this. A clue would be on the die's transistor layouts for min feature / smallest gate length devices to see all the gates oriented in the same direction for minimum CD transistors. That would be a clue that stepped offset 2x exposure might be used in the process to acheive minimum "sub-optical" CDs.....

update Feb 10th 2006
A well known leader of a famed reverse engineering firm in Ottawa, has practically confirmed the unidirectional orientation of MOS gate electrodes in the most advanced Intel devices. This so far anecdotal evidence, seems to support the possible implementation of nm scale precision, stepped offset dual exposure as a potential means to generate suboptical gate lengths at Intel - among other possiblities, and its success at delaying interest by Intel in immersion litho step and scan litho tool buys, apparently.

SMRs - Suspended Microfluidic Resonant sensors / detectors

Curious devices these are, using mems techniques to make suspended microfluidic channel resonators. These devices integrate a microfluidic biochemical / protein concentrator structure directly coupled to a MEMS suspended microfluidic channel - cantilever resonator, for mass balance detection of detected material.

Similar to a more conventional QCM - quartz crystal oscillator mass shift detection, but with the added twist of suitablity to biochemistry applications of wet chem detection - biomedical and biochemical.

Apparently the devices protoyped to date by Manalis' group in MIT have not yet yielded any (public) detection sensitivity advance over more conventional QCM mass balance detection - for reasons unknown.

A couple of thoughts I had relate to the sensitivity challenges -

CLICK READ MORE... for rest of article.

1] that pressurized microfluidic flows ( if pressurized from the coupled integrated fluidic biochemical concentrators ) might stiffen the suspended microchannel cantelevers in unpredictable ways, and

2] that the signal to noise of the sub 100Khz resonators might not be optimal - which if the present structures are retained, might gain benefit from the methods used in the more advanced recent design Inficon QCM thin film thickness rate controllers - by using a transmitted and received pulse train for the detection of the mass shift, rather than a quasistatic excitation.

Inficon's more novel QCM thin film thickness monitors, employ a patented method to send out a pulse train waveform near resonance, and cleanly detects a reflected pulse train (while not transmitting) to interrogate for phase and amplitude detection - with NO CW excitation of the QCM crystal.

In some sense this is very close to the techniques used in Acoustic microscopy - with some variation that the acoustic path length / time delay is nominally fixed in a sensor interogation, versus acoustic microscopy application.

Apparently Inficon's novel QCM signal methods have useful benefits to resolvable minimum detectable mass change in the Inficon thin film controller / monitor.

How this might be analogously implemented in SMRs of Manalis is something to think about, and as to whether the Inficon methods might benefit the S/N or detectable sensitivity of the novel SMR, and if it is possible to do at all.

Something to ponder.

UPDATE - Feb 3rd 2006
- come to think of it, if the SMR is operated discrete stopped flow, the pressure stiffening / desensitizing concern can be alleviated by stopped flow, and interleaved resonance interrrogation. By depressurizing the microchannel, any pressure stiffening can be eliminated as a sensitivity concern, although pressure decay relaxation time constant might slow the Quasi Real Time Performance. AHA !

Sunday, December 11, 2005

PDMS Microfluidic Mixer - Lateral Pneumatic Concept

12-11-05 At the same 12-8-05 Thursday Bay Area MEMS Journal Club Meeting, Narayan Sundararajan of Intel described in his presentation to the group, some interesting development work that Intel is persuing in the Digital Health R&D work. Fascinating stuff, microfluidics and single molecule detection methods and more.

CLICK READ MORE... for rest of article.

Nara described several things that he has been working on, and there was emphasis on novel innovations - oriented towards building blocks for single moelcule detection with microfluidics.

There was description of a 3-d fluidic sheath confinement method which employs a lateral and more tricky vertical sheath flows to permit 2D confinement of a flowing analyte - to enchance S/N in flourescence detection of low concentration analyte flows and to avoid wall interactions by use of the flowing sheath protection.

Nara also talked about a unique simple to fabricate lateral pneumatic PDMS microfluidic actuator - that can rely on using only a single PDMS molded layer to implement pneumatically actuated fluidic mechanisms with a very simple microfab process. No complicated multi layer soft lithography required to build some pretty sophisticated devices. This was very innovative and Nara demonstrated a functioning peristalic pump implemented using the method, as well as a simpler variable flow restrictor.

Nara brought up the point that the smooth flat vertical sidewalls - in the thin membrane sidewall actuators - were not able to implement a lateral pneumatic actuated mixer. It was not stated so explicitly, but this was apparent from what was described in trying to observe mixing with the flat sidewall devices.

I saw this and had my interest piqued, since I remember that when fluid flows make sharp turns, the resultant lateral/radial gradient in flow velocity, generates a dispersive effect in the flow profile past the sharp turn.

Clearly this observation could result in a useful method to make a variation of the lateral pneumatic PDMS structure, to enable a multistage mixer for the channel flow, when surrounded by a PDMS lateral pneumatic structure. The sidewall shape just had to be modified to generate lateral flow velocity gradients.

When Nara said that the smooth sidewalls of the tested lateral PDMS pneumatic channel did not mix - the observation I had was to replace the smooth horizontal PDMS wall profile of the pneumatic actuator - with either a zig zag, or series of protrusions of some indeterminate shape periodicity and (a)symmetry ( 1 sided or 2 sides of the lateral pneumatic PDMS actuator )

So this is what we will attempt to prototype in the coming months to demonstrate that the simple cost effective lateral pnuematic PDMS channel actuator ( valve / peristaltic pump structure concepts ) might be extended to flow mixing with similar PDMS single layer process simplicity.

One of the challenges will be to ensure that the foot of the PDMS wall still adheres to the substrate to maintain a seal to the fluid channel, and the second will be to observe how the mixing efficiency varies with 1] the shapes of the tested sidewall lateral profile, 2] # of "mixing elements" and 3] asymmetry of the structures.

I remember several efforts at generating mixers in PDMS microfluidics and the challenges are not particularly trivial such as in DEP ( dielectrophoresis ) microfluidic mixers for example.....

Friday, December 09, 2005

NanoMetrology Improvement in Atomic Force Microscopy

12-09-2005 I will describe a novel method to improve nanoscale metrology using high aspect ratio scanning nanoprobes ( Atomic Force Microscopy )

Nanoscale metrology of very fine nano/ microfabricated features is extremely challenging. Accurate nanoscale metrology of structures formed in Integrated Circuit manufacture and development is important commercially.

Regrettably, Scanning Probe Microscopy metrology runs into what one might call an "probe artifact limited" resolution Barrier to metrology / imaging resolution of small "nanofabricated" structures, such as one finds in deep submicron Integrated Circuits and the like.

Seemingly desireable very high aspect ratio probe tips, bend flex and experience slip stick effects, which can limit usable metrology repeatablity and working "resolution" performance of the intended measurements. This occurs even with tapping mode imaging or other resonant imaging modes that are commonly associated with dramatic reductions in lateral / frictional slip stick.

The most troublesome of these artifacts arise from bending and flexing of extremely small and high aspect ratio probe tips as found with nanotube modified tips, electron beam deposited tips, or FIB - focused ion beam shaped / modified tips, where one has desirable high aspect ratio conceivably useful for imaging smaller high aspect ratio sample features, but the resultant images are often prone to undesireable step artifacts, limiting lateral dimensional metrology accuracy at the nanoscale.

This occurs even when resonant cantilever imaging modes such as Tapping ( RMS amplitude detection ) which already greatly reduces slip stick effects to a minimum, since nothing is dragging on the surface as with contact mode imaging.

CLICK READ MORE... for rest of article.

The interest in using nanotube modified like filametary like probe tips ( by modifying a more conventional microfabricated Atomic Force cantilever probe ) to attempt to scan / image / measure Integrated Circuit features often runs into a simple, yet challenging issue.

High aspect ratio "Filametary" extensions to the Apex of the probe tip, can be of usefully high aspect ratio and small enough diameter of tube/filament extension, to profile small structures such as sub 100nm wide gaps / vias / contact holes or similar.

BUT in using such a small filamentary nanotube like tip, the nanotube or other very high aspect ratio "filament" itself contributes substantially to image artifacts in the AFM image, due to the softness of the high aspect ratio slender nanotube ( or FIB shaped tip or electron beam depositied nanotip for examples), even when using resonant cantilever imaging modes.

If the end of the contacting tip moves laterally in a significant variable manner, relative to the probe cantilever body or larger conventional tip base, it can get a bit challenging to acheive desireable nanoscale accuracy in the measurement one is trying to undertake.

AFM microscopes controllably scan an XY image field pattern or some derivative ( like the predictive/adaptive scanning fields ) to form an "image data 2 D extent" not necessarily rectangular or square, but more often than not conventional 2D image XY scan field - rectangular or square.

The Z or height data of the sample being imaged, is most typically derived from constant force data obtained by servoing the probe cantilever for constant bend / force while scanning in 2 dimensions the lateral image extents.

( sample surface tracking can be done with contact mode, tapping or ostensibly "non-contact" / FM detection resonant modes - but the concept is basically the same - constant force servoing whether it be with RMS amplitude detection or phase / Frequency servoing ). Tapping type imaging tends to be preferred, with non-contact resonant imaging a useful alterative as both modes are largely free of simpler frictional lateral streaking type artifacts ( slip stick ).

One can produce constant height data from the Scanning Probe measurement and likewise lateral metrology of features with height defining edges setting the feature widths to be measured ( taking into account the ideal rigid body assumption of the probe tip shape ).
This is often called CD or critical dimension measurement in the terminology of IC fabrication.

It is often wrongly thought that this softness of the nanotube modified AFM tip, makes the potential application of nanotube modified tips nearly worthless for accurate lateral metrology, due to the buckling and bending the of the tube - mounted or grown at the probe tip apex, may experience.

But if one closely examines the actual behaviour of the slender nanotube while imaging, some key points become observable ( with a resonant cantilever probe imaging mode ).

Over relatively flat surfaces, few artifacts due to bending or buckling can be observed if the scan speed is kept to usefully low speeds - and the lateral bending can be made fairly consistent hence able to be "calibrated for" or compensated for in accurate metrology.

And obviously the probe force ( amplitude / force constant ) needs to be kept reasonably low to mitigate excessive buckling of the high aspect probe region, while scanning on relatively flat surfaces.

Usefully low forces can be obtained by lower resonance amplitudes for tapping imaging, or by using probe cantilevers of low enough force constant or combinations thereof.

Nanoscale metrology is often related to measurements of widths of fabricated structure lines ( eg. MOSFET gates, wiring interconnect for a few common examples ) or etched holes, as is found in fabricating electrical vias before interconnect wiring deposition as another interesting metrology example...observed in commercial IC fabrication.

These structures to be measured are NOT flat and do cause noticeable metrology error term artifacts when imaging with a nanotube or other high aspect ratio probe ( even seen with an FIB - focused ion beam shaped / modified probe tip, if the aspect ratio of the FIB filament tip is high enough / soft enough in lateral force constant )

Careful observation of the probe tip behavior while scanning, by understanding the image artifacts present when traversing noticeable step height topography, will see that much of the undesireable seemingly tricky behaviour of the slender high aspect ratio nanotube tip is mostly compression buckling of the nanotube when the probe is descending a step.

In contrast to the errors due to descending related buckling of the slender region of the high aspect ratio tip, when the nanotube or other slender filament is Ascending or climbing a step - the tube / filament is under TENSION and as such has pretty usefully accurate step placement needed for accurate lateral dimensional metrology.

Regrettably most all imaging control and analysis programs for Scanning Probe Microscopy (nano) metrology, do not provide any useful program code or routines to do the obvious improvement - reconstruct a synthesized image for metrology applications - of step edge position, where the image data is comprised mostly of relatively flat regions and steps.

How can a more accurate synthetic image of of AFM data using a nanotube or other high aspect ratio tip, be derived from artifact laden images that have tubes experiencing compressive buckling placement errors on descents of steps, be calculated?

Since Atomic / Scanning Probe Microscopes move the AFM probe tip cantilever typically in a raster pattern - with Trace and retrace ( as called in DI / Veeco Nanoscope instruments for example ), the probe goes back and forth across the mostly similar region at least 1 full cycle back and forth ( with slight offset in the slow scan direction between trace and retrace line data).

In traversing what we will call here the Forward Direction, most all features with have 1 side having the probe ascending ( rising ) in that "image" line data set, and the nanotube / high aspect ratio tip will be under tension on the rising edge of the step, with attendent benefits to the accuracy of the metrology of the rising step lateral placement ( low bending buckling tip artifacts ).

And the other step side of typical features ( still with the tip moving in what we are calling the "Forward scan direction" ), will have the probe tip descending "other" step, with the result that the "descending" features which the nanotube / high aspect ratio probe tip will likely experience noticable buckling related lateral errors, with somewhat random tip "placement" - very undesireable for accurate lateral nanoscale dimensional metrology.

We can generate data that is a subset of line data from each of two fast scan directions - to derive a data set which the nanotube / high aspect ratio tip is either quasi static ( nearly neutral / slight compression, or in tension), ie free of major tube/ tip related compressive buckling data errors, with the tip ascending larger steps, reconstructed by an data image line pair or two directions of scanning mostly over the same physical region, using rising tip data or flat regions taken selectively from the two opposite direction line data sets..

One determines from the first direction's data set, the compressively artifacted buckling ( descending tip ) regions - and replaces these error prone data subregions, selectively with the same physical region scanned in the opposite direction. The probe tip will have now scanned that previously descending step, in the opposite direction, by ascending the same step, eliminating or greatly reducing the magnitude of compressive buckling lateral error artifacts of the high aspect region of the modified AFM tip.

This method of scan data synthesis permits algorthmic elimination of major step descending buckling error artifacts from reducing metrology accuracy of lateral dimensions.

There are variants of the proposed method that can be applied to adaptive scanning for faster metrology data aquisition that are apparent from this innovation.

There are technical details of issue here - the opposite direction data sets have to be sufficiently well calibrated in correlation of physical data points to be of practical use. In one type of instrument this is partially accomplished with a variety of calibration constants in the scan calibration.

But the implementation of the required algorithm to derive a scan data set that is proincipally free of larger compressive buckling artifacts from a slender flexible probe descending a step is fairly straightforward to do.

One can easily envision that this can also be applied to novel scan fields - non-orthogonal and efficient scan field subsets that implement tracking scan fields and the like.

There is the possibility of applying this method of derived image data, mostly free of compressive probe tip buckling artifacts in rotated image scan fields and when the typical box averaging algorithms are employed for addressing the minor metrology error term seen with unaveraged data, where line roughness is not desired to be a contributor to the measurement (error ) of a feature width.

Sunday, October 16, 2005

WISDOM of PAOLO GARGINI (process technology)

I thought this series of quotes from Paolo, was very apt in
guiding successful device technology development, or in fact
any R&D effort which is complicated and substantive in
technical challenge.

Oftentimes, people who ignore these words of wisdom,
or sadder yet don't understand the nuggets within, find
poor success in solving technology development challenges,
and will often not comprehend the organizational root
causes of project or team failure.

The best teams in development are often fluid and agile,
taking this wise advice to heart.


..................................................................................

5 [wise] LESSONS OF TECHNOLOGY DEVELOPMENT

quote of PAOLO GARGINI
(re: process technology)
Director of Intel Technology (process) Development Strategy
Intel Fellow
Chairman of ITRS
...................................

FIRST LESSON
The Right Things may Happen for the Wrong Reasons

SECOND LESSON
Predictors of Engineering Limits have Always been Proven Wrong by the Right Improvements

THIRD LESSON
It Would be Wrong to Believe that the Right Fundamental Limits Don’t Exist

FOURTH LESSON
It is Wise to Look For The Right Solutions before Things Start to go Wrong

FIFTH LESSON
It Would be Wrong to Delay Taking Action and not Doing the Right Thing at the Right Time

............................
and no Paolo is not a personal friend
but I worked at Intel Livermore '84-86 when he headed Intel Logic TD
quoted from Paolo's 2004 Semicon West presentation


Sunday, October 02, 2005

Fabless or Fabbed .... the ongoing Jousting

trackback url:
http://www.siliconvalleywatcher.com/mt/mt-tb.cgi/546

sites that mention Real men have fabs. . .chipmakers profit from making their own:

» Headline (and picture) of the day…. from helzerman.com
Real men have fabs.. or so says Tom Foremski in his column today citing a presentation by Gartner chip analyst Bryan Lewis. Basically, the article boils down to the last few lines.. This means that those chipmakers that own and operate fabs will be... ...read more

date September 21, 2005 01:07 PM

Comments on Fabless vs. Fabbed Posturing

Real Men have Fabs is a bit trite.
This is coming from a 22yr veteran process engineer.

The Real Issue - is how to best make money from microdevices and to have your company prosper and grow.

It is not a question of $B fabs, versus nothing, it is a question of given your assets ( human, capital and plant ) how do you maximize profits. Oftentimes it is too easy to give up and take the easy way out.

Given any kind of business model, you can make money if you bother to sweat the details, understand the markets and sell well and profitably.
CLICK READ MORE... for rest of article.

One excellent fab model with no $B fab vain ego, is the superbly run Linear Technology. They sweat the details and there are NO $B capital expeditures in sight. I once ran into an IT Support engineer from LT and he was alternately meekly bemoaning the old computers running the business and taking pride in the fact they were old machines ( DEC Alphas and older PCs ) but that LT's profits ran like clockwork.

The main unspoken weakness of Fabless models is that there is mostly a huge overeliance on PEACE between CHINA and TAIWAN, that is in fact pretty darn shakey at present. That is the unspoken risk hardly ever faced with a degree of reality by any articles .

Fabless IC yields are significantly harder to improve, because the interface between the Fabless engineers and the Foundry has natural Boundaries of significance not to be trifled with. Only weak management or engineers expect the impossible and misplan with abandon.

This makes it for a substantive limiter in rate of yield improvement ( process learning for device specific issues ) but there are also other factors to consider in the Fabless business model.

Fabless devices which use bleeding edge processes MUST have high enough ASP's / Margin, to accomodate the slower rate of Yield Learning. Facts of Life in the Fabless perspective. It is not better nor worse, but different.

Low margin Fabless product types have much less margin for gross yield glitches than High Margin Fabless devices, as margins and asps are typically in a range that is considerably less forgiving of low yield or yield glitches.

Another aspect to this subject is that FABs ( factories really ), to be run well, take a certain strength of stomach so to speak, that many North American microelectronics manufacturers sometimes are weak in.

Case in Point was the mid-80's "Fear" of the vaunted Japanese IC manufacturing skills. Both National Semiconductor and Intel at the time "succumbed" to the exaggerations, and for the time in the mid 80's, there was a modest cry wolf attitude, the sky is falling, etc., about the future of IC Fab Manufacturing in the US.

The then despondent Intel, reeling from DRAM withdrawl, did not accept that it was principally due to specific technical difficulties not being properly addressed by the responsible folks that should have been paying very close attention to their work. Some Intel and other managers of wafer fab domain in the mid-to early 80's - were pretty timid technical manufacturing leaders, as one might call it.

The fear of the Japanese at the time was greatly overblown. Intel, through Barrett's Superb Manufacturing Accumen (with well deserved Fab Kudos to him), blew that one out of the water - with the result that Intel is the biggest FAB business and most successful today.

Despite the credentials of those involved in the mid 80s, the cries of "the sky is falling" - now seems pretty hollow.

The seeds of FAB supremacy of Intel today were laid with the Battle Cry of Gambati in Livermore and elsewhere ( Gambati is Japanese for On-Guard or similar ).

Limits of capability are often in the mind, from weaknesses of discipline of thought. Fabless is best for those who do not have the stomach to manage the huge complexity of FAB manufacturing and Yield Improvement. Quite daunting even to the "best" of engineers, if you don't keep your nose to the grindstone and focus focus focus, and do so strictly pragmatically.

It is too easy to overcomplicate pretty straightforward yield problems, and miss how to do the real yield improvement in fab. Often times yield is held down due to not paying attention to details, and you cannot every take anything for granted ever.

The phrase of the Reagan years - "Trust but Verify" is a mantra appropriate for fab yield improvement. If you let rest technical issues due to bureaucratic ( artificial ) boundaries, and your own FAB's yield suffers - you have no-one else to blame but yourself. It is nice to complain, but better to work hard and sweat the details.

Case in point is that time after time, low yields persist because someone or many, did not pay attention, and misinterpreted data or the limits to an experiment. Often this is subtle to the unsuspecting, but when all hell breaks loose - you better know your stuff cold.

Despite the sometimes seemingly grimy aspect of manufacturing - success at the art requires discipline and insight that some do not have, else you better count on having wages of offshore low wage factories to accomodate your sloth.

The trite phrase "Real Men Have Fabs" is overused and at times inappropriate.

"Real Men" pay attention to the details of their business and do not stray from their responsibilities, FAB or FABLESS, catchy phrases notwithstanding.