is the first company to develop silicon packaging for electronic
components, enabling miniaturized hermetic and thermally optimized
packages to be produced cost-effectively on silicon wafers for labor
saving automated assembly.
Thermal Management in LED Packaging Read Hymite's paper on how combining the superior thermal properties of
silicon with micromachining and 3D lithography can create a high
performance LED package of the smallest possible size.
Hymite's North American sales office
gears up for more business.
The company has expanded its offices near Dallas to ramp up
for the hot HB-LED market.