ROHS Compliance

AMD Statement on RoHS Compliance
RoHS Compliant Changes to Processors and Chipsets
AMD Position Statement on Lead Reduction
AMD is committed to reducing the lead content in all its product lines in an environmentally responsible, technologically feasible, and cost-effective manner without sacrificing the current high levels of performance, quality, and reliability. As a result, AMD has initiated lead-free research and development programs to identify and evaluate possible lead-tin solder substitutes, while working with suppliers and other companies to establish lead-free standards and testing requirements.

AMD Lead Reduction Overview
Lead in electronic products has come under increased regulatory scrutiny due to the growing number of electronic products requiring end of life treatment and disposal. Additionally, global concerns regarding human health and environmental risks associated with hazardous substances has led the European Union to enact the Directive on the Restriction of the use of certain Hazardous Substances (RoHS) which limits the use of Lead, Mercury, Cadmium, Hexavalent Chromium, Polybrominated biphenyls or Polybrominated diphenyl ethers in electronic products. This directive takes effect on July 1, 2006. Similar legislation is pending in China. The continued use of lead in some specific and limited technical applications has been found to be technically justified and necessary since no feasible alternatives are currently available, and is thus excluded from the RoHS directive.

Largely due to the RoHS Directive, AMD customers are requesting information on product lead content and lead reduction roadmaps. This directive along with other pending legislation applies to a defined list of electronic equipment, including AMD chipsets and CPUs. Small amounts of lead have been used in AMD components in Ball Grid Array/Fine-Pitch Ball Grid Array (BGA/FBGA) solder balls, solder pastes, solder used to attach pins to the organic package, and flip chip solder bumps inside the semiconductor package.

AMD has complied with the RoHS directive and, in fact, AMD products designated as “RoHS compliant” have achieved the significant milestone of meeting the requirements of the ROHS directive one year in advance of the July 1, 2006 deadline.*

Background

Although only small amounts of lead have been commonly used in discrete components, IC packages, and printed circuit boards, its presence in these products is an increasingly visible governmental and environmental concern.
AMD is committed to reducing lead in its products in order to satisfy customer and regulatory demands. At the same time AMD is confident that the low lead concentrations present in its legacy and future products do not represent a risk to human health or the environment during product use, or during controlled removal and treatment at product end of life.
Our lead reduction/elimination program is consistent with worldwide industry practice. AMD began defining alternatives for production of lead-free packaging in 2000, and plans to offer RoHS compliant products according to customer demand. Meeting customer functionality and reliability requirements for their own products has been and will continue to be an important consideration.
AMD has participated in key industry consortia (National Electronics Manufacturing Initiative, Inc. [NEMI], High Density Packaging Users Group [HDPUG], and is working with universities (Georgia Tech, Northwestern University) and trade associations (American Electronics Association [AeA], Electronic Industries Alliance [EIA], Semiconductor Industry Association [SIA], European Semiconductor Industry Association [ESIA]) in order to develop specifications, and an industry definition for “lead-free” products.

AMD Products

AMD microprocessors and chipsets do not intentionally contain the RoHS restricted substances: cadmium, mercury, hexavalent chromium, PBBs, or PBDEs. AMD is removing lead from applications where feasible, is limiting the use of lead in its products, and is continuing lead-free research and development efforts.
Although lead containing solder cannot be completely eliminated from all applications today, AMD engineers have developed effective technical solutions to reduce lead content in microprocessors and chipsets to ensure RoHS compliance while minimizing costs and maintaining product features. There is no change to fit, functional, electrical or performance specifications. Quality and reliability standards for RoHS compliant products are expected to be identical compared to current packages.
For microprocessors, the solder used to attach passives to the topside of the package will be replaced with a lead free solder to meet RoHS compliance requirements.
For chipsets, the solder used to attach passives (if present) to the topside of the package will be replaced with a lead free solder. Also, the Ball Grid Array/Fine-Pitch Ball Grid Array (BGA/FBGA) solder will be replaced with a lead free solder to make these components RoHS compliant. For wire-bond chipsets only, some of the package materials are being replaced with materials that can withstand the higher reflow temperatures required for motherboard mounting.

RoHS Compliant Material Availability

AMD currently offers production volume for a variety of ROHS-compliant microprocessors and chipsets.

For further questions regarding AMD's RoHS compliance status for CPUs and chipsets, please contact your AMD sales representative.

* Based on the Commission Decision 2005/747/EC to amend the Annex to the RoHS Directive, published in the Official Journal of the European Union, dated October 25, 2005.