LongRun2 Technology
As semiconductor designs migrate to advanced process geometries like 90nm, 65nm, 45nm and beyond, major challenges to traditional design scaling methodologies have appeared. There are two major categories of challenges that must be addressed to enable continued scaling of performance gains and power reductions in these new geometries.

First, as the geometry shrinks, the variation in transistor performance across the manufacturing process is growing rapidly. These expanding variations of transistor speed result in a far wider distribution between the offered minimum performance point ("Slow/Slow corner", which typically sets the frequency specification) and maximum performance point ("Fast/Fast corner", which typically sets the power specification). As these distributions widen, it may be impractical to achieve the high yields necessary for low cost. Companies are thus forced to accept higher cost parts (by accepting yield loss), or reduced specifications (widening the allowed range to keep cost down).

The second major challenge is the exponential growth in leakage power that occurs particularly in 90nm and beyond. This parasitic leakage power delivers no useful work, and may result in an increase in active power, average power, standby power and burn-in power. Moreover, other factors are causing minimum operating voltage to stay fairly constant between 90nm and 65nm nodes, which reduces the potential opportunity to decrease voltage to counteract leakage power. Instead, to combat leakage many designers are choosing to run these advanced processes at lower performance points similar to older technology generations, sacrificing many of the benefits of scaling to new geometries.

LongRun2 Technology is a suite of advanced power management, leakage control and process compensation technologies that can diminish the negative effects of increasing leakage power and process variations in advanced submicron geometries. LongRun2 Technology addresses these challenges with a broad set of solutions that include advanced algorithms, innovative circuits, unique devices and structures, process techniques, software and manufacturing optimization methods. Transmeta licenses its LongRun2 Technology to semiconductor companies to use these innovations in the products they make. To date, Transmeta has licensed LongRun2 Technology to four of the world's leading integrated design manufacturers (IDMs): NEC, Fujitsu, Sony and Toshiba.

Features and Benefits

Other Approaches
LongRun2 Technology enables semi- conductor designers to continue exploiting the advantages gained by moving designs to new finer process geometries. LongRun2 Technology can help designers tighten manufacturing distributions, reduce active power and minimize standby power. Read more about features and benefits here.

Not only is LongRun2 Technology compatible with other low power techniques used in the semiconductor industry, but LongRun2 complements many of these techniques and provides additional benefits. Most of Transmeta's licensees use LongRun2 as an additional technique to their other efforts to reduce power, while LongRun2's added benefit of tightening manufacturing distributions helps to reduce cost. Read more about the comparison with other techniques. more

Please Click Here for additional information on LongRun2 Technology.

  Transmeta™ LongRun2™ White Paper
Click here to access white paper. Copyright: © 2008 Transmeta Corporation. All rights reserved.
Date: August 27, 2008
Click here to access white paper.
File Size: (11 pages, 529 KB PDF file)

  Transmeta™ LongRun2™ Technology Brief
Click here for the PDF version. Copyright: © 2008 Transmeta Corporation. All rights reserved.
Date: July 30, 2008
Click here for the PDF version.
File Size: (2 pages, 232 KB PDF file)

  Power Reduction using LongRun2 in Transmeta's Efficeon Processor
Location:2006 Spring Processor Forum
Copyright:© 2006 Transmeta Corporation, — May 2006
Click here for the PDF version.
File Size:(35 pages, 1.20 MB)