Japanese
(International Conference on Electronics Packaging)
General Chair Committee Registration Form Registration Fees
Advanced Program Poster Session Invited Speeches Plant Tour
Author's person click here, please. [How to Paper](English)
[How to Paper](Japanese)
A submission time limit of a manuscript is February 20th.
Sponsored by: Japan Institute of Electronics Packaging (JIEP) IEEE CPMT Society Japan Chapter
Mutual Cooperation: EMPC2009 (Italy)