Japanese

 

 

 (International Conference on Electronics Packaging)

 

    General Chair    Committee    Registration Form    Registration Fees  

 

 Advanced Program    Poster Session    Invited Speeches    Plant Tour 

 
 
 

 Author's person click here, please. [How to Paper](English)

[How to Paper](Japanese)

 A submission time limit of a manuscript is February 20th.

 

Sponsored by:
Japan Institute of Electronics Packaging (JIEP)
IEEE CPMT Society Japan Chapter


JIEP     IEEE     CPMT     Kyoto International Conference Center

Mutual Cooperation: EMPC2009 (Italy)