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The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.

If you’re looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its journals, conferences and workshops, committee activities, local chapter events, educational programs and awards.

2009 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 25)
March 15-19, 2009   San Jose, CA USA

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
April 1-3, 2009   Rome, Italy

International Conference on Electronics Packaging (ICEP)
April 14-16, 2009   Kyoto, Japan

10th Int'l Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009)
April 26-29 2009   The Netherlands


CPMT Transactions
Profiles of our three IEEE Transactions; how to submit papers or contact the Editors
CPMT Society Newsletter
Read the latest Society news from around the globe.
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Chapter Directory
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Nano Packaging Technical Committee
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Career Center: Jobs Available
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