ITCC ITES Logos

Anter Corp. Logo

Hosted by:
Anter Corporation, USA

Co-Chairs:
Daniela S. Gaal
Peter S. Gaal

To Attend or Present A Paper:
E-mail: Click here to e-mail

Home

Languages: 

English French Spanish Chinese

Welcome to the official web site of the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings are published in hard cover format following the conference and a rigorous peer review.


August 29 - September 2, 2009
Pittsburgh, PA USA


Hosted by:
Anter Corporation, USA


Co-Chairs:
Daniela S. Gaal
Peter S. Gaal


Papers are solicited in all applications related to THERMOPHYSICAL PROPERTIES measurement methods, equipment, processes, theory, new developments, etc. In addition to the traditional topics, the conference will focus attention on green-energy applications, energy conservation, with new improved insulations and research related to global warming.

The web site will be updated frequently as more information becomes available. Please direct all inquiries to: itcc-ites2009@thermalconductivity.org