August 08, 2011
Today's conventional inorganic electronic devices are brittle, and while they have a certain flexibility achieved using ultrathin layers of inorganic materials, these devices are either flexible, meaning they can be bent, or they are stretchable, containing ...
Today's news
- TI achieves ZigBee Smart Energy 1.1 certification
- NANIUM and 3D Systems Packaging Research Center join forces to enable Chip-Last commercialization
- UCLA engineers create polymer light-emitting devices that can be stretched like rubber
- Photovoltaics energy-conversion system powered by heat alone
- Swiss contract manufacturer Escatec to drastically increase its R&D; headcount and turnover
- Microsemi makes Intrinsic-ID's Security IP on its Flash-based cSoCs, FPGAs and development boards
- Altreonic ports RTOS to dual-core processor
- Bridgelux raises $60 million for LED push
- Tower transfers SiGe process to Israel
- Battery anode startup raises $65 million
New Products
- Haptics controller chip for enhanced display tactile feedback
- Digital direction finding receiver offers 120MHz instantaneous bandwidth
- General purpose premium noise-treated softline coaxial cable assembly
- Elpida says its sampling first 25-nm DRAMs
- Panel PC targets self service environment
- SSD firm rolls accelerators, caching tool
- ‘Unbreakable’ security IP now on Flash-based cSoCs
- Space saving high-current inductor offers high-performance benefits
- High-capacity inverter/charger offers long term UPS capability
- High speed InGaAs linear image sensors
Next events
September 12, 2011
to September 16, 2011
- Seminars
European Solid-State Device Research Conference - Helsinki
September 16, 2011
- Workshops
MOS-AK/GSA Workshop - Helsinki
September 18, 2011
to September 22, 2011
- Exhibitions
ECOC 2011 - Geneva
September 21, 2011
to September 22, 2011
- Seminars
Connect and Protect - Portsmouth
September 28, 2011
to September 29, 2011
- Exhibitions
LED Professional Symposium + Expo 2011 - Bregenz, Austria
MOST POPULAR NEWS
- A million ARM cores to host brain simulator
- Thunderbolt: A lot of noise, but very little spark
- Moving to higher-voltage LEDs to improve light bulb efficiency
- Heinrich Hertz Institute shows broadband communication from the LED ceiling light
- Robots get Kinect's 'eyes and ears'
- Huawei rolls own baseband as LTE expands
- TSMC test runs Apple processor, says report
- Battery anode startup raises $65 million
- Amateur satellite ready to go in to action
- Wireless power could cut cord for patients with implanted heart pumps
Technical papers
Filter Wizard
Check out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Interview
Car electronics build bridges to the IT world
In the world of automotive electronics, new usage models call for closer ties between car and IT. The integration of cars into IT applications, in turn, affects the technologies deployed in the vehicles. ...
Linear Video Channel
READER OFFER
This month, Altera is giving away two Industrial Networking Kits, worth 600 Euros each, for EETimes Europe's readers to win.
Based on the Terasic DE2-115 FPGA board and featuring Altera's Cyclone IV E FPGA, the kit is a full-featured hardware platform with dual 10/100/1000 Ethernet, 128-MB SDRAM, 8-MB flash memory, 4-MB SRAM, security EEPROM, HSMC connector, GPIOs, toggle switches, and status LEDs along with USB, audio, and video capabilities. The INK supports most industrial Ethernet and fieldbus networking standards, enabling all IP vendors to support the latest generation of low-cost FPGAs.More information and data sheets
Poll
Samsung
ABI Research
NXP Semiconductors
Linear Technology
LTE
STMicroelectronics
Power
Semiconductor
Android
SoC
Wireless
FPGA
Battery
MEMS
IBM
Texas Instruments
Vishay Intertechnology
ARM
Intel
Analog Devices
Solar
IMS Research
Power Management
Maxim Integrated Products
Cypress Semiconductor
Smartphones
Analog
Freescale
TSMC
National Semiconductor
All material on this site Copyright © 2009 - 2010 European Business Press SA. All rights reserved.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.
