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SK series polyimide moulding compound

 Product ProfileThe product has the feature of both high and low temperature resistance and radiation resistance, self-lubrication and creepresistance. The high-temperature injection moulding, extrusion moulding or compression molding process can be used. Product Applications1)The product can produce polyimide of high-temperature resistance, including plastics, parts, products.2)The products are widely applied in aircrafe, aerospace, electric and electronic, hi-tech industry and so on. Product FormCan supply molding powder, shapes (plank, bar, pipe) and parts. Packing and storage(1) Package: 10kg.(2) Keep it in room temperature for two years. Performance Form of SK-010Testing itemsTesting standardUnitBrandSK-010 Appearance-- Yellow powderDensityGB1033kg/m31420Water absorption ≤(25℃, 24Hrs)GB1034%2.5Tensile strengthGB/T1040.1-2006Mpa80Tensile strengthGB/T1040.1-2006%5Flexural strengthGB9341-2000Mpa80Flexural modulusGB/T9341-2000Mpa300Compressive strengthGB/T1041-2008Mpa100 Charpy impact strengthGB/T16420-1996-25HardnessRockwell E℃40Long-term maximum service temperature-℃288Short-term maximum service temperature-℃360 Instant maximum service temperature-℃430T5(Air, 10℃/min) dTGA(STA449C/6/F)℃570 Linear expansion coefficientGB/T2572-2005℃4.7*10-5The highest temperature of using-℃360Low temperature resistance-kV/mm-269Dielectric constantGB1408Ω180Surface resistivityGB1410m3/1014Rate of Volume wearGB3960(N·m)10-15Friction coefficientGB3960-0.2Remarks1、 Characteristic value not guaranteed;2、 The powder of the product can be mixed with glass fiber, carbonfiber, PTFE and graphite to produce composite materials. PerformanceTesting itemsTesting standardUnit BrandSK-0110SK-0120SK-0130Appearance--Yellow powderYellow powderYellow powder Resin characteristics--SemicrystalAmorphousAmorphous DensityGB1033kg/m3142014001400Water absorption ≤(25℃, 24Hrs)GB1034% strengthGB/T1040.1-2006Mpa708080 ElongationGB/T1040.1-2006%578Flexural strengthGB9341-2000Mpa80100100Flexural modulusGB/T9341-2000Mpa250030002500Compressive strengthGB/T1041-2008Mpa150 

SK series polyimide resin

PerformanceTesting itemsTesting standardUnitBrandSK-0170SK-0180SK-0190Appearance--Yellow powderYellow powderYellow powderResin characteristics--SemicrystalAmorphousAmorphousDensityGB1033kg/m3140013501400Water absorptionGB1034% Tensile strengthGB/T1040.1-2006Mpa1208080ElongationGB/T1040.1-2006%20258Flexural strengthGB9341-2000Mpa150-100Compressive strengthGB/T1041-2008Mpa180-150 Charpy impact strengthGB/T16420-1996kJ/m2180-50HardnessShore D-80-85Tg(N2, 10℃/min)-℃310(DMA)280(TMA)334(TMA)T5(Air, 10℃/min) dTGA(STA449C/6/F)℃520510510 Linear expansion coefficientGB/T2572-2005℃4.7*10-52.9*10-52.0*10-5 The highest temperature of using-℃260235270 Low temperature resistance-℃-248-248-248Dielectric constantGB1408kV/mm180180180 Surface resistivityGB1410Ω101410151015Rate of Volume wearGB3960m3/(N·m)10-1510-1610-16Friction coefficientGB3960-、Characteristic value not guaranteed;2、The powder of the product can be mixed with glass fiber, carbon fiber,PTFE and graphite to produce composite materials.

SK series polyimide plastic injection

PerformanceTesting itemsTesting standardUnitBrandSK-0210SK-0220SK-0230Appearance--Yellow particleAmbre particleBrown particleDensityGB1033kg/m3141012701400 Water absorption(25℃,24Hrs)GB1034%≤0.33≤0.25≤0.3 Tensile strengthGB/T1040.1-2006Mpa12710580 ElongationGB/T1040.1-2006%587Flexural strengthGB9341-2000Mpa16911080Flexural modulusGB/T9341-2000Mpa4230-2300Compressive strengthGB/T1041-2008-169140150Charpy impact strengthGB/T16420-1996kJ/m2-14040HardnessShore D---85Tg(N2, 10℃/min)DSC(DSC204/1/F)℃275215250T5d(Air, 10℃/min)TGA(STA449C/6/F)℃--500 The highest temperature of using-℃260170225Low temperature resistance-℃-248-248-248Dielectric constantGB1408kV/mm180-180Surface resistivityGB1410Ω1015-1010Volume wear rateGB3960m3/(N·m)10-16-10-16Friction coefficientGB3960-0.20.370.2Remarks1. Characteristic value not guaranteed.2. The granules of the product can be mixed with glass fiber, carbon fiber,PTFE and graphite to make wear-resistant and self-lubricating materials. Thegranules can also modify PPS, PEI, PEEK etc. Recommend molding process BrandValueBack-end(℃)Middle piece(℃)Middle piece(℃)Nose(℃)Molds(℃)Injection speedInjection pressureSK-0210 series310~350350~380370~385380~390120~200Middle high speedHigh/medium pressureSK-0220 series300~330330~350360~380390~395200Middle high speedhigh/medium pressureSK-0230 series310~330330~340340~350340~355120~170Middle high speedhigh/mediumpressureRemarks(1)Resin need to 150℃ dry 2~4 hours before use.(2)This process conditions only for reference data, production need according to processing conditionsappropriate adjustments.(3)Production materials don’t in the screw retention time more than 10 minutes, the production after needcrowded empty in the machine, and cleaning material feeding cleaning nitrogen-treated barrel.(4)Because of polyimide matrix harmony refers to the low flow, it is recommended to use a shorter, sprueolder (flat gate) injection mold.(5)Suggest products heat treatment in oven with 160~180℃ 2 hours before use. Performance Form of Polyimide CompositesTesting itemsTesting standardUnitPerformance Form of PolyimideSK-0210-1SK-0210-2SK-0220-1SK-0220-2SK-0230-1SK-0230-2Density g/cm31.501.551.501.401.501.55Tensile strengthGB/T1040-2006 Mpa 70651252008590Flexural strengthGB/T9341-2000Mpa90901502509080Compressive strengthGB/T1041-2008Mpa150150200150150150Notched charpy impact strengthGB/T16420-1996KJ/m2151560702020The highest temperature of using-℃290290180180225225Insulativity--NYYNNYFriction coefficient-- Characteristic value not guaranteed;2. -1: carbon fiber, -2: glass fiber;3. The powder of the product can be mixed with graphite, PTFE, PPS,PEI and PEEK to produce compositematerials.

SK bismaleimide resin

PerformanceTesting itemsUnitBrand Appearance- Light yellow powderAssay%≥80 Melting point℃80-90 Metal ion assay-≤200ppmVolatile%≤1 Product Characteristic◆Low melting point, can lower to 80℃;◆Good solubility, can be dissolved in acetone and other solvents;◆Good toughness, impact strength after curing can reach more than 20KJ/M2, to solve some problems,like the ordinarybismaleimide resin with high melting point, poor toughness, difficult to dissolve and so on. Product Applications◆ The product can be copolymerized with diallyl bisphenol A as the matrix resin of the composite material .The compositematerial has high- temperature resistance, radiation resistance and high strength.◆The product can be modified ordinary epoxy resin and can be used to make insulating materials, adhesives. After thecomposite, it has high- temperature resistance, good insulation, good toughness;◆ As the product is soluble and can be melt, you can coat or impregnate fiber materials and other methods to produce largecomponents. 

SK series epoxy resin

Product ProfileSK series of heat-resistant epoxy resins have higher reactivity than common epoxy resins, in addition, having short curing time,good processability and high efficiency. Chemical structure is glycidyl epoxy resins which have several epoxide groups and the structure of benzenes are in molecular structure, the higher density of crosslinking and aromatic will come into being during the curing, and make the curing product has good heat-resistance and stability. It can be used in the coating, cast-resin insulated product, fiber-reinforced plastic, adhesive, composite products, which required higher heat-resistance level. Common curing agent is: Amine,Anhydrides, Dimethylimidazole; for example DDS, MNA. Product Applications(1) As high performance composites matrix resin(2) As heat-resistant adhesive resin, coating materials, reinforced materials, casting mould plastic materials, adhesive, UVcurable ink, paint and modifying agents, etc. at 200℃ or above. Packing and storage(1) Package: 20kg or 50kg;(2) Shelf life: 1 year (at room temperature). Performance Form of EpoxyBrandSK-0430 AttentionAppearance (1) The epoxy resin is alkaliproof butnot acidproof;(2) The epoxy resin should be storing ina dry, shady & airproof condition.(3) You can heat the resin to80 ℃around when the viscosity is highor you can add acetone or othersolvents to reduce the viscosity.Additional, in order to avoid thedangerous of thermal expansion,please open the package when youheat it.(4) Because of the resin's multifunctionand high epoxy value, it will releasebig quantity of heat when curing. Itshould be paid more attention.(Gardner color) ≤12Epoxy value(/100g)0.8~0.9(Pa•S@50℃) Viscosity3.5~5.5Volatile Content (%)0.2 Hydrolysis chlorine (%)0.2(Ordinary class)0.1(Electronic grade)Mixture ratio (MNA Parts by weight)1 : 1.31~1.35Curing condition (MNA)Curing condition:120℃1h+180℃2h+200℃4hCured show brown Tg>230℃Curing condition (DDS)Heat the resin to 90~110℃. Then add the curingagent and mix them to absolutely dissolvedCuring condition:120℃1h+160℃4h+200℃4hCured show brown 240~260℃The processing above is only for reference. Please convince of the reliability when you are using. Curing spectrum of Epoxy Curing systemCuring processGlass transition temperature(℃)SK-0430: MNA=100:126120℃/1h+180℃/2h+200℃/4h231.298 Application example of Epoxy

Polyimide moul...





Polyimide resin




Polyimide plastic...




Epoxy resin


Research technique
The company has applied for 12 patents related to the invention of China, and has been granted a patent of invention of China by 5.


The company has a young and vibrant, innovative management and technical team


Products are widely used in aerospace, marine machinery, integrated circuits, electronic and electrical fields


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Changzhou Sunchem New Material Co., Ltd. was founded in March 2009, located in Benniu Town, Xinbei District, Changzhou City, with registered capital of RMB30,000,000.


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