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Technology & Research


Hisilicon announce full range of AI camera and MobileCam chip and solutoin

HiSilicon has launched a full range of low-power, high-performance AI camera chips and solutions to address the pain points of surveillance intelligence. The models are Hi3559AV100, Hi3519AV100, Hi3516DV300, Hi3516CV500, and have a variety of PQ+AI capability combinations, covering high-end 8K to low-end 1080P monitoring applications.

HiSilicon released its latest 2M Mainstream and 4M Professional Smart IP Camera SoC Hi3516CV500 and Hi3516DV300

Along with the improvement of the industry and algorithms, Hi3516CV500 and Hi3516DV300 are particularly targeting on 2M and 4M IP Camera market through the advantages introduced as below.

HiSilicon released its latest 4K AI SoC Hi3519AV100

HiSilicon has released its latest 4K AI SoC Hi3519AV100 targeting in the mid-range surveillance market.

Smart VQE – A New Way to Improve Your Audio Experience

HiSilicon has released its latest 4K AI SoC Hi3519AV100 targeting in the mid-range surveillance market.

Huawei Launches the First Full-Stack All-Scenario AI Chip and Solution Ascend 310, Enabling the Smart Future

[October 10, 2018, Shanghai] Huawei has launched the first full-stack all-scenario AI chip Ascend 310 on HUAWEI CONNECT 2018.

HiSilicon Introduces Reference Solution to Simplify Adding Alexa Voice Service (AVS) to Set-Top Boxes

HiSilicon officially announces a reference solution available today that enables consumers to use the convenience of Alexa via a push-to-talk (PTT) voice remote for set-top box (STB) and TV applications.

HiSilicon Launches Next Generation HD-HEVC SoC for Low Cost Set Top Box Applications

HiSilicon officially launches at IBC 2018, Amsterdam, the next generation HD chipset with support for the industry leading Broadcast CA, HEVC video decoding and a
Mutli-format Demodulator that supports DVB-C, DVB-S/S2/S2x, DVB-T/T2 and ISDB-T standards.

Key Information About the Huawei Kirin 980

Berlin, Germany, August 31, 2018.
Mr. Yu Chengdong (Richard Yu), CEO of Huawei's Consumer BG, delivered the keynote speech "The Ultimate Power of Mobile AI" at IFA and announced the launch of Huawei's next-generation mobile phone SoC chipset Kirin 980.

HiSilicon's High-performance 8K Decoding and Display TV Chip Hi3751V811

Hi3751 V811 is a high-performance TV chip with 8K decoding and display.

Hisense Unveils 4K Smart TV U8 Series with HiSilicon Hi3751V811 Chip Inside

With the most advanced HiSilicon chipset Hi3751V811 inside, Hisense unveils 4K Smart TV U8 Series.

HiSilicon Empowers KONKA to Unveil the 4K Smart TV V1 Series with Hi3751V811 Inside

HiSilicon Technologies Co., Ltd, as a world leading fabless IC semiconductor company, today officially announced the collaboration with Konka, one of the World’s leading TV corporation.

Brief Introduction on HDR10+

As a leading consuming device silicon vendor, Hisilicon is going to bring this latest HDR feature to consumers soon.