Combining each of our globally competitive technologies to provide World Class Assemblies
High speed chip shooters down to 0402 size, fine pitch to .019", chip scale, flip chip, flex, and double-sided assembly, in-circuit ATE testing
Automated die attach of silicon and GaAs IC's, and both gold and aluminum wire down to .0007" dia.
Full cassette to cassette automated processing, featuring through-holes, multilayers, controlled lines for microwave, plated ceramic for high-power, and precision laser trimming
Active laser trim, functional test, mechanical assembly, milling, packaging, and turnkey program management
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electronic manufacturing services, smt, mcm, hybrids, contract electronics manufacturing, electronic assembly, electronic test, microelectronics assembly, wire bonding, multichip modules, surface mount, smt, smt, smt, mcm, mcm, mcm, cob, cob, cob, quality, quality, quality hytel