Most Viewed Articles for the Week of November 17, 2008
With Senior Editor Alex Braun attending the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., the topic figures prominently in our Top 5 this week. But the buzz about 3-D integration wasn’t enough to completely quell the interest in knowing more about recent layoffs and growing economic concerns — or especially about continuing progress through technology generations at TSMC.