Intel® Core™ Processors

Intel® Core™ i7-3689Y Processor

4M Cache, up to 2.60 GHz

Specifications

Supplemental Information

Package Specifications

  • Sockets Supported FCBGA1023
  • Max CPU Configuration 1
  • TJUNCTION 105 C
  • Package Size 31mm x 24mm
  • Low Halogen Options Available See MDDS

Compatible Products

Consumer Chipsets

Product Name Status PCI Express Revision USB Revision Embedded Options Available TDP Recommended Customer Price Compare
All | None
Mobile Intel® HM77 Express Chipset Launched 2.0 3.0/2.0 No 4.1 W $48.00
Mobile Intel® QM77 Express Chipset Launched 2.0 3.0/2.0 Yes 4.1 W $48.00
Mobile Intel® UM77 Express Chipset Launched 2.0 3.0/2.0 No 3 W N/A
Mobile Intel® QS77 Express Chipset Launched 2.0 3.0/2.0 No 3.6 W $54.00
Mobile Intel® HM76 Express Chipset Launched 2.0 3.0/2.0 Yes 4.1 W $43.00
Mobile Intel® HM75 Express Chipset Launched 2.0 2.0 No 4.1 W $40.00

Ordering and Compliance

Retired and discontinued

Intel® Core™ i7-3689Y Processor (4M Cache, up to 2.60 GHz) FC-BGA12F, Tray

  • Spec Code SR12R
  • Ordering Code AV8063801378203
  • Step L1

Trade compliance information

  • ECCN5A992C
  • CCATSG077159
  • US HTS8542310001

PCN/MDDS Information

SR12R

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Scenario Design Power (SDP)

Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor Graphics

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel® HD Graphics, Iris™ Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the Intel® Graphics Technology page for more information.

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Max Dynamic Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Intel® Quick Sync Video

Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.

Intel® InTru™ 3D Technology

Intel® InTru™ 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.

Intel® Flexible Display Interface (Intel® FDI)

The Intel® Flexible Display Interface is an innovative path for two independently controlled channels of integrated graphics to be displayed.

Intel® Clear Video HD Technology

Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TJUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Technology

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Intel® My WiFi Technology

Intel® My WiFi Technology enables wireless connection of an UltrabookTM or laptop to WiFi-enabled devices such as printers, stereos, etc.

4G WiMAX Wireless Technology

4G WiMAX Wireless Technology provides broadband Internet access at speeds up to four times faster than 3G.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Secure Key

Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Anti-Theft Technology

Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

QR

Quality/Reliability Hold.

RS

Reschedule

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

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